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The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam

Epoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of fo...

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Bibliographic Details
Main Author: Wan Nur Fadilla, Wan Hamad
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2014
Subjects:
Epoxy foam
Composites
Structural analysis (Engineering)
Sodium bicarbonate
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33278
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spelling my.unimap-332782014-04-01T01:37:48Z The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam Wan Nur Fadilla, Wan Hamad Epoxy foam Composites Structural analysis (Engineering) Sodium bicarbonate Epoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of four parts with four different processing conditions which were at room temperature, at 80°C, with presence of catalyst (acetic acid) and with presence of reactive diluent (butyl glycidyl ether). Viscosity, density, mechanical, dielectric and thermal properties were done for all the processing conditions. Blowing agent content was varied at 5, 10, 15, and 20 phr, respectively. For all processing conditions, 20 phr revealed the lowest value for viscosity, density, mechanical properties and dielectric properties. Among four parameters, the most desired result was observed in sample processed with acetic acid and with presence of diluent because it exhibited lower dielectric constant which prefer for electronic packaging application. However, flexural strength and modulus of these epoxy foams were reduced. 2014-04-01T01:37:48Z 2014-04-01T01:37:48Z 2011 Thesis http://dspace.unimap.edu.my:80/dspace/handle/123456789/33278 en Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Epoxy foam
Composites
Structural analysis (Engineering)
Sodium bicarbonate
spellingShingle Epoxy foam
Composites
Structural analysis (Engineering)
Sodium bicarbonate
Wan Nur Fadilla, Wan Hamad
The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
description Epoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of four parts with four different processing conditions which were at room temperature, at 80°C, with presence of catalyst (acetic acid) and with presence of reactive diluent (butyl glycidyl ether). Viscosity, density, mechanical, dielectric and thermal properties were done for all the processing conditions. Blowing agent content was varied at 5, 10, 15, and 20 phr, respectively. For all processing conditions, 20 phr revealed the lowest value for viscosity, density, mechanical properties and dielectric properties. Among four parameters, the most desired result was observed in sample processed with acetic acid and with presence of diluent because it exhibited lower dielectric constant which prefer for electronic packaging application. However, flexural strength and modulus of these epoxy foams were reduced.
format Thesis
author Wan Nur Fadilla, Wan Hamad
author_facet Wan Nur Fadilla, Wan Hamad
author_sort Wan Nur Fadilla, Wan Hamad
title The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_short The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_full The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_fullStr The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_full_unstemmed The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_sort effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33278
_version_ 1643797118674010112
score 13.222552

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