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Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents

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Main Authors: Ho, Li Ngee, Dr., Teng, Fei Wu, Hiroshi, Nishikawa
Other Authors: holingee@yahoo.com
Format: Article
Language:English
Published: Taylor and Francis Group, LLC. 2014
Subjects:
Conductive adhesives
Coupling agents
Electrical resistivity
Rheology
Shear strength
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33189
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spelling my.unimap-331892017-11-29T06:59:35Z Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents Ho, Li Ngee, Dr. Teng, Fei Wu Hiroshi, Nishikawa holingee@yahoo.com lnho@unimap.edu.my nisikawa@jwri.osaka-u.ac.jp Conductive adhesives Coupling agents Electrical resistivity Rheology Shear strength Link to publisher's homepage at www.taylorandfrancisgroup.com/‎ In this study, a phenolic-based Ag flake-filled electrically conductive adhesive (ECA) was investigated in terms of rheological, electrical, and mechanical properties. To clarify the effect of various Ag flake filler content and silane coupling agents on the characteristic of the ECA, rheological properties of the Ag flake-filled ECA paste, electrical resistivity, and shear strength of the cured ECA were investigated. Results showed that an increase of Ag flake content leads to an increase in both viscosity of the ECA paste and electrical conductivity of the as-cured ECA. Silane coupling agents-treated Ag flakes have a significant effect on the electrical resistivity and shear strength in the ECAs. 2014-03-28T03:59:26Z 2014-03-28T03:59:26Z 2013-11 Article Journal of Adhesion, vol. 89(11), 2013, pages 847-858 0021-8464 http://www.tandfonline.com/doi/abs/10.1080/00218464.2013.775039#.UzTyZaiSyyo http://dspace.unimap.edu.my:80/dspace/handle/123456789/33189 en Taylor and Francis Group, LLC.
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Conductive adhesives
Coupling agents
Electrical resistivity
Rheology
Shear strength
spellingShingle Conductive adhesives
Coupling agents
Electrical resistivity
Rheology
Shear strength
Ho, Li Ngee, Dr.
Teng, Fei Wu
Hiroshi, Nishikawa
Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
description Link to publisher's homepage at www.taylorandfrancisgroup.com/‎
author2 holingee@yahoo.com
author_facet holingee@yahoo.com
Ho, Li Ngee, Dr.
Teng, Fei Wu
Hiroshi, Nishikawa
format Article
author Ho, Li Ngee, Dr.
Teng, Fei Wu
Hiroshi, Nishikawa
author_sort Ho, Li Ngee, Dr.
title Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
title_short Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
title_full Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
title_fullStr Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
title_full_unstemmed Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
title_sort properties of phenolic-based ag-filled conductive adhesive affected by different coupling agents
publisher Taylor and Francis Group, LLC.
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33189
_version_ 1643802746081509376
score 13.222552

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