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The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition

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Main Authors: Mohd Khairuddin, Md Arshad, Azman, Jalar, Ibrahim, Ahmad, Ghazali, Omar
Format: Article
Language:English
Published: Science Publications 2008
Subjects:
Zincation
Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Integrated circuits
Aluminum oxide
Zinc oxide
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/2430
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spelling my.unimap-24302009-08-14T08:45:35Z The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition Mohd Khairuddin, Md Arshad Azman, Jalar Ibrahim, Ahmad Ghazali, Omar Zincation Electroless nickel immersion gold (ENIG) Under bump metallurgy (UBM) Integrated circuits Aluminum oxide Zinc oxide Link to publisher's homepage at http://scipub.org/scipub/index.php This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment to achieve successful nickel deposition and provide reliable interconnection of under bump metallurgy in advanced packaging. During this treatment process, the aluminum pad was cleaned, activated and then coated with a layer of zinc. Systematic study was carried out to determine the best parameters, through multiple and various exposure times of the zincation process and zincation solution concentration effect on the Ni/Au surface roughness and aluminum dissolution rate on the bond pad during multiple zincation process. The ball shear strength was evaluated between eutectic 37Pb/63Sn solder ball and under bump metallurgy (UBM) interfaces across multiple zincation process. Scanning Electron Microscope (SEM), Energy Dispersive X-Ray (EDX), Atomic Force Microscopy (AFM), Focused Ion Beam (FIB) and ball shear tester were used as analytical tools. The results suggest that the multiple zincation process consistently produces a smoother surface of ENIG UBM and consequently provides a better shear strength. 2008-10-17T07:50:18Z 2008-10-17T07:50:18Z 2007 Article American Journal of Applied Sciences, vol. 4 (3), 2007, pages 133-141. 1546-9239 http://hdl.handle.net/123456789/2430 http://scipub.org/scipub/index.php en Science Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Zincation
Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Integrated circuits
Aluminum oxide
Zinc oxide
spellingShingle Zincation
Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Integrated circuits
Aluminum oxide
Zinc oxide
Mohd Khairuddin, Md Arshad
Azman, Jalar
Ibrahim, Ahmad
Ghazali, Omar
The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
description Link to publisher's homepage at http://scipub.org/scipub/index.php
format Article
author Mohd Khairuddin, Md Arshad
Azman, Jalar
Ibrahim, Ahmad
Ghazali, Omar
author_facet Mohd Khairuddin, Md Arshad
Azman, Jalar
Ibrahim, Ahmad
Ghazali, Omar
author_sort Mohd Khairuddin, Md Arshad
title The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
title_short The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
title_full The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
title_fullStr The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
title_full_unstemmed The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
title_sort characterization of al bond pad surface treatment in electroless nickel immersion gold (enig) deposition
publisher Science Publications
publishDate 2008
url http://dspace.unimap.edu.my/xmlui/handle/123456789/2430
_version_ 1643787607296966656
score 13.222552

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