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Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder

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Main Authors: Mohd Arif Anuar, Mohd Salleh, Mohd Mustafa Al-Bakri, Abdullah, Muhammad Hafiz, Zan Hazizi, Flora, Somidin, Noor Farhani, Mohd Alui, Zainal Arifin, Ahmad, Prof.
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Elsevier B.V. 2013
Subjects:
Composite
Lead-free solder
Powder metallurgy
Silicon nitride
Online Access:http://dspace.unimap.edu.my/123456789/23648
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spelling my.unimap-236482020-09-11T02:25:53Z Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder Mohd Arif Anuar, Mohd Salleh Mohd Mustafa Al-Bakri, Abdullah Muhammad Hafiz, Zan Hazizi Flora, Somidin Noor Farhani, Mohd Alui Zainal Arifin, Ahmad, Prof. arifanuar@unimap.edu.my mustafa_albakri@unimap.edu.my hafizhazizi@unimap.edu.my zainal@eng.usm.my Composite Lead-free solder Powder metallurgy Silicon nitride Link to publisher's homepage at http://www.elsevier.com The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of Sn-0.7Cu/Si 3N 4 lead-free composite solder were fabricated via the application of powder metallurgy (PM) techniques. The influences of the Si 3N 4 particulates in the monolithic matrix solder on the melting point temperature (T m), microhardness value, lap-shear strength, and surface fracture mechanisms were investigated based on the weight percentage addition used (0.5wt%, 1.0wt%, and 1.5wt%). Minimal alteration of the melting point temperature of the composite solder sample was obtained. Improvements in the microhardness value and lap-shear strength were found for higher reinforcements of Si 3N 4 particulates, which revealed the formation of a more ductile fracture mode in the composite solder samples. The increasing addition of Si 3N 4 allowed the formation of homogeneous and finer dimples. Overall, the addition of Si 3N 4 particulates to the Sn-0.7Cu lead-free solder should be higher than 1.0wt%, as these compositions showed superior mechanical properties. 2013-02-18T03:50:21Z 2013-02-18T03:50:21Z 2012-10 Article Materials Science and Engineering A, vol. 556, 2012, pages 633-637 0921-5093 http://www.sciencedirect.com/science/article/pii/S0921509312010015 http://dspace.unimap.edu.my/123456789/23648 en Elsevier B.V.
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Composite
Lead-free solder
Powder metallurgy
Silicon nitride
spellingShingle Composite
Lead-free solder
Powder metallurgy
Silicon nitride
Mohd Arif Anuar, Mohd Salleh
Mohd Mustafa Al-Bakri, Abdullah
Muhammad Hafiz, Zan Hazizi
Flora, Somidin
Noor Farhani, Mohd Alui
Zainal Arifin, Ahmad, Prof.
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
description Link to publisher's homepage at http://www.elsevier.com
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Mohd Arif Anuar, Mohd Salleh
Mohd Mustafa Al-Bakri, Abdullah
Muhammad Hafiz, Zan Hazizi
Flora, Somidin
Noor Farhani, Mohd Alui
Zainal Arifin, Ahmad, Prof.
format Article
author Mohd Arif Anuar, Mohd Salleh
Mohd Mustafa Al-Bakri, Abdullah
Muhammad Hafiz, Zan Hazizi
Flora, Somidin
Noor Farhani, Mohd Alui
Zainal Arifin, Ahmad, Prof.
author_sort Mohd Arif Anuar, Mohd Salleh
title Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
title_short Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
title_full Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
title_fullStr Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
title_full_unstemmed Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
title_sort mechanical properties of sn-0.7cu/si 3n 4 lead-free composite solder
publisher Elsevier B.V.
publishDate 2013
url http://dspace.unimap.edu.my/123456789/23648
_version_ 1678593996435226624
score 13.222552

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