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Methods of measurement of LTCC metallization thickness

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Main Authors: Khiang, Lee Soo, Norhawati, Ahmad, Muammar, Mohamad Isa, Rosidah, Alias
Other Authors: norhawati@unimap.edu.my
Format: Working Paper
Language:English
Published: Institute of Electrical and Electronics Engineers (IEEE) 2012
Subjects:
Conductive pastes
Conductor pastes
Cost effectives
Electrical resistances
LTCC (low temperature co fired ceramic)
LTCC substrates
Metallization
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/20231
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spelling my.unimap-202312012-07-09T09:21:43Z Methods of measurement of LTCC metallization thickness Khiang, Lee Soo Norhawati, Ahmad Muammar, Mohamad Isa Rosidah, Alias norhawati@unimap.edu.my muammar@unimap.edu.my Conductive pastes Conductor pastes Cost effectives Electrical resistances LTCC (low temperature co fired ceramic) LTCC substrates Metallization Link to publisher's homepage at http://ieeexplore.ieee.org/ Metallization provides electrical routing and serves as thermal via in LTCC (Low Temperature Cofired Ceramic) technology. High electrical and thermal conductivity is desirable. It is often achieved with the use of low electrical resistance materials, such as gold, silver and copper. The conductive paste made of these materials is expensive. Hence, the fabrication of LTCC has to be performance-wise and cost effective. The width, length and thickness of metallization are associated with the amount of conductor paste used. The thickness of metallization governs the functionality and performance of some components, such as resistor. In this paper, the physical attributes of LTCC substrate and its metallization was studied. Due to the constraint brought by the physical attributes of LTCC samples, various methods had been carried out. This paper also summarized the pros and cons of each method. The methods are limited to the equipment available. 2012-07-09T09:21:42Z 2012-07-09T09:21:42Z 2008-12-01 Working Paper p. 1-7 978-142442315-6 http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=4786684 http://hdl.handle.net/123456789/20231 en Proceedings of the International Conference on Electronic Design (ICED) 2008 Institute of Electrical and Electronics Engineers (IEEE)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Conductive pastes
Conductor pastes
Cost effectives
Electrical resistances
LTCC (low temperature co fired ceramic)
LTCC substrates
Metallization
spellingShingle Conductive pastes
Conductor pastes
Cost effectives
Electrical resistances
LTCC (low temperature co fired ceramic)
LTCC substrates
Metallization
Khiang, Lee Soo
Norhawati, Ahmad
Muammar, Mohamad Isa
Rosidah, Alias
Methods of measurement of LTCC metallization thickness
description Link to publisher's homepage at http://ieeexplore.ieee.org/
author2 norhawati@unimap.edu.my
author_facet norhawati@unimap.edu.my
Khiang, Lee Soo
Norhawati, Ahmad
Muammar, Mohamad Isa
Rosidah, Alias
format Working Paper
author Khiang, Lee Soo
Norhawati, Ahmad
Muammar, Mohamad Isa
Rosidah, Alias
author_sort Khiang, Lee Soo
title Methods of measurement of LTCC metallization thickness
title_short Methods of measurement of LTCC metallization thickness
title_full Methods of measurement of LTCC metallization thickness
title_fullStr Methods of measurement of LTCC metallization thickness
title_full_unstemmed Methods of measurement of LTCC metallization thickness
title_sort methods of measurement of ltcc metallization thickness
publisher Institute of Electrical and Electronics Engineers (IEEE)
publishDate 2012
url http://dspace.unimap.edu.my/xmlui/handle/123456789/20231
_version_ 1643793001859776512
score 13.222552

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