Characterization of Intermetallic Growth in Gold Ballbonds on Aluminum Metallization
The objective of this project is to study the capability of gold wire bonding process by investigating the intermetallic growth between gold ball bonds and aluminum bond pad. The study includes applying thermal storage conditions at 150 °C and 200 °C at various intervals time. The relationships betw...
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| フォーマット: | Learning Object |
| 言語: | English |
| 出版事項: |
Universiti Malaysia Perlis
2008
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| オンライン･アクセス: | http://dspace.unimap.edu.my/xmlui/handle/123456789/1332 |
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