Cover Image

Study of melting of low temperature metal for fused filament fabrication (fff) process

This project paper is about the adhesion of 2 dissimilar materials. The materials involved are metal and polymer. The concept is based on printing of solder track on Fused Filament Fabrication (FFF) printed model. The objective of this project is to construct an extruder suitable for the deposition...

Full description

Saved in:
Bibliographic Details
Main Author: Ong Tun Yau
Format: Academic Exercise
Language:English
English
Published: 2022
Subjects:
TS200-770 Metal manufactures. Metalworking
Online Access:https://eprints.ums.edu.my/id/eprint/34375/1/24PAGES.pdf
https://eprints.ums.edu.my/id/eprint/34375/2/FULLTEXT.pdf
https://eprints.ums.edu.my/id/eprint/34375/
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.ums.eprints.34375
record_format eprints
spelling my.ums.eprints.343752022-10-11T03:59:13Z https://eprints.ums.edu.my/id/eprint/34375/ Study of melting of low temperature metal for fused filament fabrication (fff) process Ong Tun Yau TS200-770 Metal manufactures. Metalworking This project paper is about the adhesion of 2 dissimilar materials. The materials involved are metal and polymer. The concept is based on printing of solder track on Fused Filament Fabrication (FFF) printed model. The objective of this project is to construct an extruder suitable for the deposition of conductive materials on thermoplastic substrates fabricated by FFF process. Therefore, a prototype is constructed to carry out soldering to represent the metal printing process. The next objective is to investigate the optimum printing speed for the deposition and adhesion on the printed surface fabricated by FFF process. Thus, three printing speeds are calculated by adjusting the input pulse frequency of stepper motors and the optimum speed will be selected. Other than this, effect of surface conditions of thermoplastic substrates fabricated by FFF process on adhesion of conductive materials is investigated. Three printed substrates are surface treated with sandpaper, ironing and copper spray respectively to achieve this objective. From the results, the pattern of solder tracks for each printing speed is almost the same but the number of deposited solder beads and distance between successive beads are different. The slowest printing speed is chosen for the printing of solder tracks on surface treated substrate and the results show almost the same, indicating the insignificance of printing speed and surface condition on the adhesion of solder and PLA. 2022 Academic Exercise NonPeerReviewed text en https://eprints.ums.edu.my/id/eprint/34375/1/24PAGES.pdf text en https://eprints.ums.edu.my/id/eprint/34375/2/FULLTEXT.pdf Ong Tun Yau (2022) Study of melting of low temperature metal for fused filament fabrication (fff) process. Universiti Malaysia Sabah. (Unpublished)
institution Universiti Malaysia Sabah
building UMS Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Sabah
content_source UMS Institutional Repository
url_provider http://eprints.ums.edu.my/
language English
English
topic TS200-770 Metal manufactures. Metalworking
spellingShingle TS200-770 Metal manufactures. Metalworking
Ong Tun Yau
Study of melting of low temperature metal for fused filament fabrication (fff) process
description This project paper is about the adhesion of 2 dissimilar materials. The materials involved are metal and polymer. The concept is based on printing of solder track on Fused Filament Fabrication (FFF) printed model. The objective of this project is to construct an extruder suitable for the deposition of conductive materials on thermoplastic substrates fabricated by FFF process. Therefore, a prototype is constructed to carry out soldering to represent the metal printing process. The next objective is to investigate the optimum printing speed for the deposition and adhesion on the printed surface fabricated by FFF process. Thus, three printing speeds are calculated by adjusting the input pulse frequency of stepper motors and the optimum speed will be selected. Other than this, effect of surface conditions of thermoplastic substrates fabricated by FFF process on adhesion of conductive materials is investigated. Three printed substrates are surface treated with sandpaper, ironing and copper spray respectively to achieve this objective. From the results, the pattern of solder tracks for each printing speed is almost the same but the number of deposited solder beads and distance between successive beads are different. The slowest printing speed is chosen for the printing of solder tracks on surface treated substrate and the results show almost the same, indicating the insignificance of printing speed and surface condition on the adhesion of solder and PLA.
format Academic Exercise
author Ong Tun Yau
author_facet Ong Tun Yau
author_sort Ong Tun Yau
title Study of melting of low temperature metal for fused filament fabrication (fff) process
title_short Study of melting of low temperature metal for fused filament fabrication (fff) process
title_full Study of melting of low temperature metal for fused filament fabrication (fff) process
title_fullStr Study of melting of low temperature metal for fused filament fabrication (fff) process
title_full_unstemmed Study of melting of low temperature metal for fused filament fabrication (fff) process
title_sort study of melting of low temperature metal for fused filament fabrication (fff) process
publishDate 2022
url https://eprints.ums.edu.my/id/eprint/34375/1/24PAGES.pdf
https://eprints.ums.edu.my/id/eprint/34375/2/FULLTEXT.pdf
https://eprints.ums.edu.my/id/eprint/34375/
_version_ 1760231287211163648
score 13.211869

Similar Items