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Microstructure Evolution at the Solder Joint During Isothermal Aging

The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic...

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Main Authors: Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak
Format: Conference or Workshop Item
Language:English
Published: IEEE 2014
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/9507/1/fkm-2014-aisha-Microstructure%20Evolution%20at%20the%20Solder.pdf
http://umpir.ump.edu.my/id/eprint/9507/
http://dx.doi.org/10.1109/IEMT.2014.7123086
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spelling my.ump.umpir.95072018-01-18T06:45:09Z http://umpir.ump.edu.my/id/eprint/9507/ Microstructure Evolution at the Solder Joint During Isothermal Aging Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic compound formation in terms of its thickness and activation energy. In this works, evolution of microstructure at the interfacial region was studied for after reflow and isothermal aging at 150 °C, up to 1000 hours. The thickness of the intermetallic was measured using ImageJ software and activation energy was calculated using measured data. The compositions of intermetallic compound were confirmed using Scanning Electron Microscopy-Energy-dispersive X-ray spectroscopy (SEM-EDX) and its microstructure were observed using optical microscope. The cross sectional microstructure of Sn-3.0Ag-0.5Cu/ImAu joint shows that Au layer disappears completely, suggesting that it was entirely dissolved into the molten solder. The same result obtained from reflowed Sn-3.0Ag-0.5Cu/immersion Sn. The thickness of IMC layer at Sn-3.0Ag-0.5Cu /ImAu interface is similar to that at at Sn-3.0Ag-0.5Cu /ImSn interface, especially for Cu6Sn5 layer. The intermetallic growths of the intermetallic structure during isothermal aging were discussed. IEEE 2014 Conference or Workshop Item PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/9507/1/fkm-2014-aisha-Microstructure%20Evolution%20at%20the%20Solder.pdf Zetty Akhtar, Abd Malek and Hardinnawirda, Kahar and Siti Rabiatull Aisha, Idris and M., Ishak (2014) Microstructure Evolution at the Solder Joint During Isothermal Aging. In: IEEE 36th International (IEMT) Electronics Manufacturing Technology Conference (IEMT 2014), 11-13 November 2014 , Johor Bahru. pp. 1-5.. ISBN 978-1-4799-8209-7 http://dx.doi.org/10.1109/IEMT.2014.7123086
institution Universiti Malaysia Pahang
building UMP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang
content_source UMP Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Zetty Akhtar, Abd Malek
Hardinnawirda, Kahar
Siti Rabiatull Aisha, Idris
M., Ishak
Microstructure Evolution at the Solder Joint During Isothermal Aging
description The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic compound formation in terms of its thickness and activation energy. In this works, evolution of microstructure at the interfacial region was studied for after reflow and isothermal aging at 150 °C, up to 1000 hours. The thickness of the intermetallic was measured using ImageJ software and activation energy was calculated using measured data. The compositions of intermetallic compound were confirmed using Scanning Electron Microscopy-Energy-dispersive X-ray spectroscopy (SEM-EDX) and its microstructure were observed using optical microscope. The cross sectional microstructure of Sn-3.0Ag-0.5Cu/ImAu joint shows that Au layer disappears completely, suggesting that it was entirely dissolved into the molten solder. The same result obtained from reflowed Sn-3.0Ag-0.5Cu/immersion Sn. The thickness of IMC layer at Sn-3.0Ag-0.5Cu /ImAu interface is similar to that at at Sn-3.0Ag-0.5Cu /ImSn interface, especially for Cu6Sn5 layer. The intermetallic growths of the intermetallic structure during isothermal aging were discussed.
format Conference or Workshop Item
author Zetty Akhtar, Abd Malek
Hardinnawirda, Kahar
Siti Rabiatull Aisha, Idris
M., Ishak
author_facet Zetty Akhtar, Abd Malek
Hardinnawirda, Kahar
Siti Rabiatull Aisha, Idris
M., Ishak
author_sort Zetty Akhtar, Abd Malek
title Microstructure Evolution at the Solder Joint During Isothermal Aging
title_short Microstructure Evolution at the Solder Joint During Isothermal Aging
title_full Microstructure Evolution at the Solder Joint During Isothermal Aging
title_fullStr Microstructure Evolution at the Solder Joint During Isothermal Aging
title_full_unstemmed Microstructure Evolution at the Solder Joint During Isothermal Aging
title_sort microstructure evolution at the solder joint during isothermal aging
publisher IEEE
publishDate 2014
url http://umpir.ump.edu.my/id/eprint/9507/1/fkm-2014-aisha-Microstructure%20Evolution%20at%20the%20Solder.pdf
http://umpir.ump.edu.my/id/eprint/9507/
http://dx.doi.org/10.1109/IEMT.2014.7123086
_version_ 1643666146880126976
score 13.211869

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