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Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration

Migration of Cu atoms from the cathode side to the anode side causes void formation in the solder joint, which is the root cause of electromigration failures in lead-free solder joints. This study investigates the effects of Zn nanoparticle-doped flux on the mechanical properties of SAC305 solder jo...

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Main Authors: Bashir, Muhammad Nasir, Khan, Niaz Bahadur, Bashir, Shahid, Khan, Abdul Faheem, Quazi, Moinuddin Mohammed, Gul, Mustabshirha, Wakeel, Saif, Hafiz Muhammad, Saad
Format: Article
Language:English
English
Published: Springer 2023
Subjects:
T Technology (General)
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
Online Access:http://umpir.ump.edu.my/id/eprint/42839/1/Effect%20of%20Zn%20nanoparticle-doped%20flux%20on%20mechanical%20properties.pdf
http://umpir.ump.edu.my/id/eprint/42839/2/Effect%20of%20Zn%20nanoparticle-doped%20%EF%AC%82ux%20on%20mechanical%20properties%20of%20SAC305%20solder%20joint%20after%20electromigration_ABS.pdf
http://umpir.ump.edu.my/id/eprint/42839/
https://doi.org/10.1007/s10854-022-09722-4
https://doi.org/10.1007/s10854-022-09722-4
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spelling my.ump.umpir.428392025-01-07T04:51:58Z http://umpir.ump.edu.my/id/eprint/42839/ Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration Bashir, Muhammad Nasir Khan, Niaz Bahadur Bashir, Shahid Khan, Abdul Faheem Quazi, Moinuddin Mohammed Gul, Mustabshirha Wakeel, Saif Hafiz Muhammad, Saad T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Migration of Cu atoms from the cathode side to the anode side causes void formation in the solder joint, which is the root cause of electromigration failures in lead-free solder joints. This study investigates the effects of Zn nanoparticle-doped flux on the mechanical properties of SAC305 solder joint under high current density. Nanoparticle-doped flux is a novel technique which mainly focused to modify the interfaces of the solder joint. Since, electromigration mainly damages the interfaces of the solder joint, so nanoparticle-doped flux technique was used to retard the electromigration damages. Electromigration test was conducted under the current density of 1 × 104 A/cm2. The electromigration test was conducted in the silicon oil bath at a maintained temperature of 80 ± 5 °C. Tensile test was conducted before and after electromigration tests for undoped and Zn nanoparticle-doped solder joints. The results showed that the mechanical strength improved after the addition of Zn nanoparticle-doped flux before and after electromigration as compared to the undoped SAC305 solder joint. The Cu migration was suppressed by Zn nanoparticle doped due to which the fractured path was not shifted from the solder bulk to the cathode side. In comparison, the undoped solder showed rapid Cu migration due to which the fracture path shifted from solder bulk to cathode interface. Springer 2023-02 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/42839/1/Effect%20of%20Zn%20nanoparticle-doped%20flux%20on%20mechanical%20properties.pdf pdf en http://umpir.ump.edu.my/id/eprint/42839/2/Effect%20of%20Zn%20nanoparticle-doped%20%EF%AC%82ux%20on%20mechanical%20properties%20of%20SAC305%20solder%20joint%20after%20electromigration_ABS.pdf Bashir, Muhammad Nasir and Khan, Niaz Bahadur and Bashir, Shahid and Khan, Abdul Faheem and Quazi, Moinuddin Mohammed and Gul, Mustabshirha and Wakeel, Saif and Hafiz Muhammad, Saad (2023) Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration. Journal of Materials Science: Materials in Electronics, 34 (321). pp. 1-8. ISSN 0957-4522. (Published) https://doi.org/10.1007/s10854-022-09722-4 https://doi.org/10.1007/s10854-022-09722-4
institution Universiti Malaysia Pahang Al-Sultan Abdullah
building UMPSA Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang Al-Sultan Abdullah
content_source UMPSA Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
English
topic T Technology (General)
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
spellingShingle T Technology (General)
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
Bashir, Muhammad Nasir
Khan, Niaz Bahadur
Bashir, Shahid
Khan, Abdul Faheem
Quazi, Moinuddin Mohammed
Gul, Mustabshirha
Wakeel, Saif
Hafiz Muhammad, Saad
Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
description Migration of Cu atoms from the cathode side to the anode side causes void formation in the solder joint, which is the root cause of electromigration failures in lead-free solder joints. This study investigates the effects of Zn nanoparticle-doped flux on the mechanical properties of SAC305 solder joint under high current density. Nanoparticle-doped flux is a novel technique which mainly focused to modify the interfaces of the solder joint. Since, electromigration mainly damages the interfaces of the solder joint, so nanoparticle-doped flux technique was used to retard the electromigration damages. Electromigration test was conducted under the current density of 1 × 104 A/cm2. The electromigration test was conducted in the silicon oil bath at a maintained temperature of 80 ± 5 °C. Tensile test was conducted before and after electromigration tests for undoped and Zn nanoparticle-doped solder joints. The results showed that the mechanical strength improved after the addition of Zn nanoparticle-doped flux before and after electromigration as compared to the undoped SAC305 solder joint. The Cu migration was suppressed by Zn nanoparticle doped due to which the fractured path was not shifted from the solder bulk to the cathode side. In comparison, the undoped solder showed rapid Cu migration due to which the fracture path shifted from solder bulk to cathode interface.
format Article
author Bashir, Muhammad Nasir
Khan, Niaz Bahadur
Bashir, Shahid
Khan, Abdul Faheem
Quazi, Moinuddin Mohammed
Gul, Mustabshirha
Wakeel, Saif
Hafiz Muhammad, Saad
author_facet Bashir, Muhammad Nasir
Khan, Niaz Bahadur
Bashir, Shahid
Khan, Abdul Faheem
Quazi, Moinuddin Mohammed
Gul, Mustabshirha
Wakeel, Saif
Hafiz Muhammad, Saad
author_sort Bashir, Muhammad Nasir
title Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
title_short Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
title_full Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
title_fullStr Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
title_full_unstemmed Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
title_sort effect of zn nanoparticle-doped flux on mechanical properties of sac305 solder joint after electromigration
publisher Springer
publishDate 2023
url http://umpir.ump.edu.my/id/eprint/42839/1/Effect%20of%20Zn%20nanoparticle-doped%20flux%20on%20mechanical%20properties.pdf
http://umpir.ump.edu.my/id/eprint/42839/2/Effect%20of%20Zn%20nanoparticle-doped%20%EF%AC%82ux%20on%20mechanical%20properties%20of%20SAC305%20solder%20joint%20after%20electromigration_ABS.pdf
http://umpir.ump.edu.my/id/eprint/42839/
https://doi.org/10.1007/s10854-022-09722-4
https://doi.org/10.1007/s10854-022-09722-4
_version_ 1822924889520078848
score 13.235362

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