表紙画像

Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die

Dicing operation in cutting hard-brittle ceramic die using nickel–diamond blade causes cracked or chipped die, accelerated tool wear and, ultimately, shortage of blade lifetime. This study aims to analyse the structural integrity of dicing blade in terms of tool wear, surface roughness, microstructu...

詳細記述

保存先:
書誌詳細
主要な著者: S.K., Lim, M. F., Zamri, Ahmad Razlan, Yusoff
フォーマット: 論文
言語:English
出版事項: Elsevier 2022
主題:
T Technology (General)
TA Engineering (General). Civil engineering (General)
TS Manufactures
オンライン･アクセス:http://umpir.ump.edu.my/id/eprint/36666/1/LIM%20SYH%20KAI.pdf
http://umpir.ump.edu.my/id/eprint/36666/
https://doi.org/10.1016/j.procir.2022.03.073
https://doi.org/10.1016/j.procir.2022.03.073
タグ: タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
id my.ump.umpir.36666
record_format eprints
spelling my.ump.umpir.366662023-01-10T04:57:42Z http://umpir.ump.edu.my/id/eprint/36666/ Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die S.K., Lim M. F., Zamri Ahmad Razlan, Yusoff T Technology (General) TA Engineering (General). Civil engineering (General) TS Manufactures Dicing operation in cutting hard-brittle ceramic die using nickel–diamond blade causes cracked or chipped die, accelerated tool wear and, ultimately, shortage of blade lifetime. This study aims to analyse the structural integrity of dicing blade in terms of tool wear, surface roughness, microstructure and elements during dicing. The measurements of wear blade on the blade are made by confocal microscope, whereas surface and elemental analyses are carried out with EDX SEM. Results show that the volumetric wear rate of blade is 20%, similar to roughness. The microstructure of the blade changes with occurrence of Aluminium owing to abrasive wear mechanism during cutting. Elsevier 2022-06-01 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/36666/1/LIM%20SYH%20KAI.pdf S.K., Lim and M. F., Zamri and Ahmad Razlan, Yusoff (2022) Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die. Procedia CIRP, 108. pp. 465-469. ISSN 2212-8271 (Online). (Published) https://doi.org/10.1016/j.procir.2022.03.073 https://doi.org/10.1016/j.procir.2022.03.073
institution Universiti Malaysia Pahang Al-Sultan Abdullah
building UMPSA Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang Al-Sultan Abdullah
content_source UMPSA Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic T Technology (General)
TA Engineering (General). Civil engineering (General)
TS Manufactures
spellingShingle T Technology (General)
TA Engineering (General). Civil engineering (General)
TS Manufactures
S.K., Lim
M. F., Zamri
Ahmad Razlan, Yusoff
Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
description Dicing operation in cutting hard-brittle ceramic die using nickel–diamond blade causes cracked or chipped die, accelerated tool wear and, ultimately, shortage of blade lifetime. This study aims to analyse the structural integrity of dicing blade in terms of tool wear, surface roughness, microstructure and elements during dicing. The measurements of wear blade on the blade are made by confocal microscope, whereas surface and elemental analyses are carried out with EDX SEM. Results show that the volumetric wear rate of blade is 20%, similar to roughness. The microstructure of the blade changes with occurrence of Aluminium owing to abrasive wear mechanism during cutting.
format Article
author S.K., Lim
M. F., Zamri
Ahmad Razlan, Yusoff
author_facet S.K., Lim
M. F., Zamri
Ahmad Razlan, Yusoff
author_sort S.K., Lim
title Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_short Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_full Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_fullStr Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_full_unstemmed Structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
title_sort structure integrity analysis on nickel–diamond blade in dicing of hard-brittle ceramic die
publisher Elsevier
publishDate 2022
url http://umpir.ump.edu.my/id/eprint/36666/1/LIM%20SYH%20KAI.pdf
http://umpir.ump.edu.my/id/eprint/36666/
https://doi.org/10.1016/j.procir.2022.03.073
https://doi.org/10.1016/j.procir.2022.03.073
_version_ 1822923243215912960
score 13.250246

類似資料