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Effect of laser loop on surface morphology of copper substrate and wettability of solder joint

The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and conta...

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Main Authors: Roduan, Siti Faqihah, Wahab, J. A., Aiman, M. H., Zaifuddin, A. Q., Mohd Salleh, M. A. A., Mahadzir, I.
Format: Conference or Workshop Item
Language:English
Published: IOP Publishing Ltd 2019
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
Online Access:http://umpir.ump.edu.my/id/eprint/35901/1/Effect%20of%20laser%20loop%20on%20surface%20morphology%20of%20copper%20substrate%20and%20wettability%20of%20solder%20joint.pdf
http://umpir.ump.edu.my/id/eprint/35901/
https://doi.org/10.1088/1757-899X/701/1/012040
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spelling my.ump.umpir.359012023-04-10T03:14:59Z http://umpir.ump.edu.my/id/eprint/35901/ Effect of laser loop on surface morphology of copper substrate and wettability of solder joint Roduan, Siti Faqihah Wahab, J. A. Aiman, M. H. Zaifuddin, A. Q. Mohd Salleh, M. A. A. Mahadzir, I. T Technology (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and contact angle measurement test was conducted to measure the geometry of the micro-grooves pattern and wettability of the solder joint respectively. The results showed that the improvement in laser loop parameter increased the depth of the micro-grooves due to the more exposed time which allows more material ablation. It also showed that the contact angle of textured substrate is smaller than the untextured substrate which results in better wettability. IOP Publishing Ltd 2019 Conference or Workshop Item PeerReviewed pdf en cc_by http://umpir.ump.edu.my/id/eprint/35901/1/Effect%20of%20laser%20loop%20on%20surface%20morphology%20of%20copper%20substrate%20and%20wettability%20of%20solder%20joint.pdf Roduan, Siti Faqihah and Wahab, J. A. and Aiman, M. H. and Zaifuddin, A. Q. and Mohd Salleh, M. A. A. and Mahadzir, I. (2019) Effect of laser loop on surface morphology of copper substrate and wettability of solder joint. In: IOP Conference Series: Materials Science and Engineering; Electronic Packaging Interconnect Technology Symposium 2019, EPITS 2019, 24 - 25 November 2019 , Penang. pp. 1-8., 701 (012040). ISSN 1757-8981 https://doi.org/10.1088/1757-899X/701/1/012040
institution Universiti Malaysia Pahang Al-Sultan Abdullah
building UMPSA Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang Al-Sultan Abdullah
content_source UMPSA Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic T Technology (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
spellingShingle T Technology (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
Roduan, Siti Faqihah
Wahab, J. A.
Aiman, M. H.
Zaifuddin, A. Q.
Mohd Salleh, M. A. A.
Mahadzir, I.
Effect of laser loop on surface morphology of copper substrate and wettability of solder joint
description The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and contact angle measurement test was conducted to measure the geometry of the micro-grooves pattern and wettability of the solder joint respectively. The results showed that the improvement in laser loop parameter increased the depth of the micro-grooves due to the more exposed time which allows more material ablation. It also showed that the contact angle of textured substrate is smaller than the untextured substrate which results in better wettability.
format Conference or Workshop Item
author Roduan, Siti Faqihah
Wahab, J. A.
Aiman, M. H.
Zaifuddin, A. Q.
Mohd Salleh, M. A. A.
Mahadzir, I.
author_facet Roduan, Siti Faqihah
Wahab, J. A.
Aiman, M. H.
Zaifuddin, A. Q.
Mohd Salleh, M. A. A.
Mahadzir, I.
author_sort Roduan, Siti Faqihah
title Effect of laser loop on surface morphology of copper substrate and wettability of solder joint
title_short Effect of laser loop on surface morphology of copper substrate and wettability of solder joint
title_full Effect of laser loop on surface morphology of copper substrate and wettability of solder joint
title_fullStr Effect of laser loop on surface morphology of copper substrate and wettability of solder joint
title_full_unstemmed Effect of laser loop on surface morphology of copper substrate and wettability of solder joint
title_sort effect of laser loop on surface morphology of copper substrate and wettability of solder joint
publisher IOP Publishing Ltd
publishDate 2019
url http://umpir.ump.edu.my/id/eprint/35901/1/Effect%20of%20laser%20loop%20on%20surface%20morphology%20of%20copper%20substrate%20and%20wettability%20of%20solder%20joint.pdf
http://umpir.ump.edu.my/id/eprint/35901/
https://doi.org/10.1088/1757-899X/701/1/012040
_version_ 1822923092380352512
score 13.250246

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