Effect of laser loop on surface morphology of copper substrate and wettability of solder joint
The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and conta...
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| 言語: | English |
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IOP Publishing Ltd
2019
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| オンライン･アクセス: | http://umpir.ump.edu.my/id/eprint/35901/1/Effect%20of%20laser%20loop%20on%20surface%20morphology%20of%20copper%20substrate%20and%20wettability%20of%20solder%20joint.pdf http://umpir.ump.edu.my/id/eprint/35901/ https://doi.org/10.1088/1757-899X/701/1/012040 |
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my.ump.umpir.359012023-04-10T03:14:59Z http://umpir.ump.edu.my/id/eprint/35901/ Effect of laser loop on surface morphology of copper substrate and wettability of solder joint Roduan, Siti Faqihah Wahab, J. A. Aiman, M. H. Zaifuddin, A. Q. Mohd Salleh, M. A. A. Mahadzir, I. T Technology (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and contact angle measurement test was conducted to measure the geometry of the micro-grooves pattern and wettability of the solder joint respectively. The results showed that the improvement in laser loop parameter increased the depth of the micro-grooves due to the more exposed time which allows more material ablation. It also showed that the contact angle of textured substrate is smaller than the untextured substrate which results in better wettability. IOP Publishing Ltd 2019 Conference or Workshop Item PeerReviewed pdf en cc_by http://umpir.ump.edu.my/id/eprint/35901/1/Effect%20of%20laser%20loop%20on%20surface%20morphology%20of%20copper%20substrate%20and%20wettability%20of%20solder%20joint.pdf Roduan, Siti Faqihah and Wahab, J. A. and Aiman, M. H. and Zaifuddin, A. Q. and Mohd Salleh, M. A. A. and Mahadzir, I. (2019) Effect of laser loop on surface morphology of copper substrate and wettability of solder joint. In: IOP Conference Series: Materials Science and Engineering; Electronic Packaging Interconnect Technology Symposium 2019, EPITS 2019, 24 - 25 November 2019 , Penang. pp. 1-8., 701 (012040). ISSN 1757-8981 https://doi.org/10.1088/1757-899X/701/1/012040 |
| institution |
Universiti Malaysia Pahang Al-Sultan Abdullah |
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UMPSA Library |
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Institutional Repository |
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Asia |
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Malaysia |
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Universiti Malaysia Pahang Al-Sultan Abdullah |
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http://umpir.ump.edu.my/ |
| language |
English |
| topic |
T Technology (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics |
| spellingShingle |
T Technology (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Roduan, Siti Faqihah Wahab, J. A. Aiman, M. H. Zaifuddin, A. Q. Mohd Salleh, M. A. A. Mahadzir, I. Effect of laser loop on surface morphology of copper substrate and wettability of solder joint |
| description |
The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and contact angle measurement test was conducted to measure the geometry of the micro-grooves pattern and wettability of the solder joint respectively. The results showed that the improvement in laser loop parameter increased the depth of the micro-grooves due to the more exposed time which allows more material ablation. It also showed that the contact angle of textured substrate is smaller than the untextured substrate which results in better wettability. |
| format |
Conference or Workshop Item |
| author |
Roduan, Siti Faqihah Wahab, J. A. Aiman, M. H. Zaifuddin, A. Q. Mohd Salleh, M. A. A. Mahadzir, I. |
| author_facet |
Roduan, Siti Faqihah Wahab, J. A. Aiman, M. H. Zaifuddin, A. Q. Mohd Salleh, M. A. A. Mahadzir, I. |
| author_sort |
Roduan, Siti Faqihah |
| title |
Effect of laser loop on surface morphology of copper substrate and wettability of solder joint |
| title_short |
Effect of laser loop on surface morphology of copper substrate and wettability of solder joint |
| title_full |
Effect of laser loop on surface morphology of copper substrate and wettability of solder joint |
| title_fullStr |
Effect of laser loop on surface morphology of copper substrate and wettability of solder joint |
| title_full_unstemmed |
Effect of laser loop on surface morphology of copper substrate and wettability of solder joint |
| title_sort |
effect of laser loop on surface morphology of copper substrate and wettability of solder joint |
| publisher |
IOP Publishing Ltd |
| publishDate |
2019 |
| url |
http://umpir.ump.edu.my/id/eprint/35901/1/Effect%20of%20laser%20loop%20on%20surface%20morphology%20of%20copper%20substrate%20and%20wettability%20of%20solder%20joint.pdf http://umpir.ump.edu.my/id/eprint/35901/ https://doi.org/10.1088/1757-899X/701/1/012040 |
| _version_ |
1822923092380352512 |
| score |
13.250246 |