Analysis of liquid film flow in between two different plates
In flip chip technology, analysis of underfill flow between chip and substrate are important to prevent the chip from breaking. In other words, the welded solder balls in the packaged chip, underfill epoxy is filled into the gap between a chip and a substrate. It is because to prevent cracks on the...
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| Format: | Undergraduates Project Papers |
| Language: | English |
| Published: |
2016
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/16241/1/09.Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates.pdf http://umpir.ump.edu.my/id/eprint/16241/ |
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