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Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing

Injection molding is a manufacturing process for producing part for both thermoplastic and thermosetting plastic material. Objective of this project to determine the parameter effect to the warpage and shrinkage of the handphone casing and to determine the optimization parameter for reduce the warpa...

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Main Author: Mohd Norhafizi, Rohaizat
Format: Undergraduates Project Papers
Language:English
Published: 2010
Subjects:
TP Chemical technology
Online Access:http://umpir.ump.edu.my/id/eprint/1482/1/Mohd_Norhafizi_Rohaizat_%28CD_5028%29.pdf
http://umpir.ump.edu.my/id/eprint/1482/
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spelling my.ump.umpir.14822021-06-25T03:57:14Z http://umpir.ump.edu.my/id/eprint/1482/ Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing Mohd Norhafizi, Rohaizat TP Chemical technology Injection molding is a manufacturing process for producing part for both thermoplastic and thermosetting plastic material. Objective of this project to determine the parameter effect to the warpage and shrinkage of the handphone casing and to determine the optimization parameter for reduce the warpage and shrinkage. For this project 3D scanner are use to scan the hand phone casing to get the parameter and analyse with MoldFlow simulation software to optimize the effect to warpage and shrinkage. Shrinkage and warpage tendencies in molded parts,are influenced by actions taken in each and all of the manufacturing stages of part design, material selection, tool design, and processing. The mold temperature(MT), packing time (Pt), packing pressure (PP) and cooling time (Ct) in the packing stage are considered as machining parameters. As increase in mold temperature (MT), the shrinkage also increase and as increase in cooling time (Ct), the shrinkage decrease. Other than that, as increase the packing pressure (PP), the shrinkage usually decrease. 2010-12 Undergraduates Project Papers NonPeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/1482/1/Mohd_Norhafizi_Rohaizat_%28CD_5028%29.pdf Mohd Norhafizi, Rohaizat (2010) Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing. Faculty of Mechanical Engineering, Universiti Malaysia Pahang.
institution Universiti Malaysia Pahang
building UMP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang
content_source UMP Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic TP Chemical technology
spellingShingle TP Chemical technology
Mohd Norhafizi, Rohaizat
Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing
description Injection molding is a manufacturing process for producing part for both thermoplastic and thermosetting plastic material. Objective of this project to determine the parameter effect to the warpage and shrinkage of the handphone casing and to determine the optimization parameter for reduce the warpage and shrinkage. For this project 3D scanner are use to scan the hand phone casing to get the parameter and analyse with MoldFlow simulation software to optimize the effect to warpage and shrinkage. Shrinkage and warpage tendencies in molded parts,are influenced by actions taken in each and all of the manufacturing stages of part design, material selection, tool design, and processing. The mold temperature(MT), packing time (Pt), packing pressure (PP) and cooling time (Ct) in the packing stage are considered as machining parameters. As increase in mold temperature (MT), the shrinkage also increase and as increase in cooling time (Ct), the shrinkage decrease. Other than that, as increase the packing pressure (PP), the shrinkage usually decrease.
format Undergraduates Project Papers
author Mohd Norhafizi, Rohaizat
author_facet Mohd Norhafizi, Rohaizat
author_sort Mohd Norhafizi, Rohaizat
title Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing
title_short Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing
title_full Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing
title_fullStr Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing
title_full_unstemmed Optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing
title_sort optimization of molding parameter effect to warpage and shrinkage based on plastic flow simulation software: handphone casing
publishDate 2010
url http://umpir.ump.edu.my/id/eprint/1482/1/Mohd_Norhafizi_Rohaizat_%28CD_5028%29.pdf
http://umpir.ump.edu.my/id/eprint/1482/
_version_ 1703960657726013440
score 13.211869

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