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Effect of Immersion Coating Deposition Time on Solder Joint Properties

Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion...

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Main Authors: Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak
Format: Article
Language:English
Published: Trans Tech Publications, Switzerland 2016
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf
http://umpir.ump.edu.my/id/eprint/11693/
http://www.scientific.net/AMR.1133.361
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spelling my.ump.umpir.116932018-01-15T08:27:55Z http://umpir.ump.edu.my/id/eprint/11693/ Effect of Immersion Coating Deposition Time on Solder Joint Properties Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion plating process on copper pads are important as the thickness of coating will decide several properties of surface finish, such as wettability during soldering process. Thus, this study aims to investigate the effect of deposition time of immersion gold coating on wettability of the surface finish and how it affect the formation of intermetallic compounds on solder joint. In this works, deposition time of copper pads in immersion gold solution were varied from 3 minutes up to 15 minutes. The thickness of immersion gold layer that form on Cu pads were then measured using Scanning Electron Microscopy (SEM). As the main objective of this study is to study the effect of deposition time during immersion plating process towards solder joint, the pads were reflowed along with Sn-3.0Ag-0.5Cu solder in furnace under temperature 250 °C for 25 minutes. Then, the cross sections of the solder joints were examined using optical microscope in order to measure the wetting angle and thickness of intermetallic compound formed; which acceptable value in industrial area, should be below 40 ̊ and below 4μm as reflow respectively. Trans Tech Publications, Switzerland 2016 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf Zetty Akhtar, Abd Malek and Hardinnawirda, Kahar and Siti Rabiatull Aisha, Idris and M., Ishak (2016) Effect of Immersion Coating Deposition Time on Solder Joint Properties. Advanced Materials Research, 1133. pp. 361-365. ISSN 1022-6680 (print), 1662-8985 (online) http://www.scientific.net/AMR.1133.361 DOI: 10.4028/www.scientific.net/AMR.1133.361
institution Universiti Malaysia Pahang
building UMP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang
content_source UMP Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Zetty Akhtar, Abd Malek
Hardinnawirda, Kahar
Siti Rabiatull Aisha, Idris
M., Ishak
Effect of Immersion Coating Deposition Time on Solder Joint Properties
description Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion plating process on copper pads are important as the thickness of coating will decide several properties of surface finish, such as wettability during soldering process. Thus, this study aims to investigate the effect of deposition time of immersion gold coating on wettability of the surface finish and how it affect the formation of intermetallic compounds on solder joint. In this works, deposition time of copper pads in immersion gold solution were varied from 3 minutes up to 15 minutes. The thickness of immersion gold layer that form on Cu pads were then measured using Scanning Electron Microscopy (SEM). As the main objective of this study is to study the effect of deposition time during immersion plating process towards solder joint, the pads were reflowed along with Sn-3.0Ag-0.5Cu solder in furnace under temperature 250 °C for 25 minutes. Then, the cross sections of the solder joints were examined using optical microscope in order to measure the wetting angle and thickness of intermetallic compound formed; which acceptable value in industrial area, should be below 40 ̊ and below 4μm as reflow respectively.
format Article
author Zetty Akhtar, Abd Malek
Hardinnawirda, Kahar
Siti Rabiatull Aisha, Idris
M., Ishak
author_facet Zetty Akhtar, Abd Malek
Hardinnawirda, Kahar
Siti Rabiatull Aisha, Idris
M., Ishak
author_sort Zetty Akhtar, Abd Malek
title Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_short Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_full Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_fullStr Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_full_unstemmed Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_sort effect of immersion coating deposition time on solder joint properties
publisher Trans Tech Publications, Switzerland
publishDate 2016
url http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf
http://umpir.ump.edu.my/id/eprint/11693/
http://www.scientific.net/AMR.1133.361
_version_ 1643666724590977024
score 13.211869

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