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3-D conjugate heat transfer analysis of PLCC packages mounted in-line on a Printed Circuit Board

This paper presents a three dimensional heat and fluid flow analysis of two Plastic Leaded Chip Carrier (PLCC) packages mounted in tandem arrangement on a Printed Circuit Board (PCB) exposed to the free stream velocity. The numerical simulation was done using FLUENT 6.3 and the experiments were perf...

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Bibliographic Details
Main Authors: Yusoff, S., Mohamed, M., Ahmad, K.A., Abdullah, M.Z., Mujeebu, M.A., Mohd Ali, Z., Idrus, F., Yaakob, Y.
Format: Non-Indexed Article
Language:English
Published: 2009
Online Access:http://discol.umk.edu.my/id/eprint/7884/1/International%20Communications%20in%20Heat%20and%20Mass%20Transfer%20%28IF%3D2.208%29.pdf
http://discol.umk.edu.my/id/eprint/7884/
http://dx.doi.org/10.1016/j.icheatmasstransfer.2009.04.013
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http://discol.umk.edu.my/id/eprint/7884/1/International%20Communications%20in%20Heat%20and%20Mass%20Transfer%20%28IF%3D2.208%29.pdf
http://discol.umk.edu.my/id/eprint/7884/
http://dx.doi.org/10.1016/j.icheatmasstransfer.2009.04.013

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