Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
Migration of Cu atoms from the cathode side to the anode side causes void formation in the solder joint, which is the root cause of electromigration failures in lead-free solder joints. This study investigates the effects of Zn nanoparticle-doped flux on the mechanical properties of SAC305 solder jo...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Published: |
Springer
2023
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/38676/ |
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