Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma (Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging)
Effect of carbon nanotube (CNT) on the growth of intermetallic compound (IMC) layer of 96.5Sn-3.0Ag-0.5Cu/Cu substrate lead free solder system has been investigated. Sn-Ag-Cu alloy powder (SAC305) was mixed with 0.02 weight percent of CNT to produce SAC-CNT solder paste. Both SAC305 and SAC305-CNT s...
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| Main Authors: | , , , |
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| Format: | Article |
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Penerbit Universiti Kebangsaan Malaysia
2018
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/21783/ https://doi.org/10.17576/jsm-2018-4707-29 |
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