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Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the bot...

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Main Authors:	Ismail, Norliza, Ismail, Roslina, Jalar, Azman, Omar, Ghazali, Salleh, Emee Marina, Kamil, Norinsan, Rahman, Irman Abdul
Format:	Article
Published:	Springer 2018
Subjects:	N Visual arts (General) For photography, see TR TJ Mechanical engineering and machinery
Online Access:	http://eprints.um.edu.my/21782/ https://doi.org/10.1007/s10854-018-9410-8
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id	my.um.eprints.21782
record_format	eprints
spelling	my.um.eprints.217822019-08-05T07:16:29Z http://eprints.um.edu.my/21782/ Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability Ismail, Norliza Ismail, Roslina Jalar, Azman Omar, Ghazali Salleh, Emee Marina Kamil, Norinsan Rahman, Irman Abdul N Visual arts (General) For photography, see TR TJ Mechanical engineering and machinery The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups. Springer 2018 Article PeerReviewed Ismail, Norliza and Ismail, Roslina and Jalar, Azman and Omar, Ghazali and Salleh, Emee Marina and Kamil, Norinsan and Rahman, Irman Abdul (2018) Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability. Journal of Materials Science: Materials in Electronics, 29 (15). pp. 12910-12916. ISSN 0957-4522 https://doi.org/10.1007/s10854-018-9410-8 doi:10.1007/s10854-018-9410-8
institution	Universiti Malaya
building	UM Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaya
content_source	UM Research Repository
url_provider	http://eprints.um.edu.my/
topic	N Visual arts (General) For photography, see TR TJ Mechanical engineering and machinery
spellingShingle	N Visual arts (General) For photography, see TR TJ Mechanical engineering and machinery Ismail, Norliza Ismail, Roslina Jalar, Azman Omar, Ghazali Salleh, Emee Marina Kamil, Norinsan Rahman, Irman Abdul Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
description	The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups.
format	Article
author	Ismail, Norliza Ismail, Roslina Jalar, Azman Omar, Ghazali Salleh, Emee Marina Kamil, Norinsan Rahman, Irman Abdul
author_facet	Ismail, Norliza Ismail, Roslina Jalar, Azman Omar, Ghazali Salleh, Emee Marina Kamil, Norinsan Rahman, Irman Abdul
author_sort	Ismail, Norliza
title	Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
title_short	Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
title_full	Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
title_fullStr	Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
title_full_unstemmed	Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
title_sort	comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
publisher	Springer
publishDate	2018
url	http://eprints.um.edu.my/21782/ https://doi.org/10.1007/s10854-018-9410-8
_version_	1643691659637030912
score	13.223943

Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

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