Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints
Cu/SAC305/Cu solder joints were fabricated at ambient atmosphere using high-power-low-frequency ultrasonic vibration (USV) assisted hot plate reflow soldering. The influences of USV time (within 6 s) on the microstructure, hardness, yield strength and shear strength of the solder joints were investi...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Published: |
Elsevier
2016
|
| Subjects: | |
| Online Access: | http://eprints.um.edu.my/17717/ http://dx.doi.org/10.1016/j.jmatprotec.2016.06.036 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|