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Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate

The aims of this research are to investigate the effects of Ni on the physical properties of Sn58Bi-xNi lead-free solder, and to examine its interfacial reaction with the copper substrate. In the experiments, four concentrations of Ni (i.e. 0.05, 0.1, 0.5 and 1.0 wt.%) were individually added into S...

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Main Authors: Kanlayasiri, Kannachai, Ariga, Tadashi
Format: Article
Published: Elsevier 2015
Subjects:
Q Science (General)
Online Access:http://eprints.um.edu.my/16233/
https://doi.org/10.1016/j.matdes.2015.07.108
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spelling my.um.eprints.162332019-12-05T06:09:30Z http://eprints.um.edu.my/16233/ Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate Kanlayasiri, Kannachai Ariga, Tadashi Q Science (General) The aims of this research are to investigate the effects of Ni on the physical properties of Sn58Bi-xNi lead-free solder, and to examine its interfacial reaction with the copper substrate. In the experiments, four concentrations of Ni (i.e. 0.05, 0.1, 0.5 and 1.0 wt.%) were individually added into Sn58Bi and their respective microstructure, tensile strength, elongation, melting temperature, wettability and electrical resistivity of Sn58Bi-xNi were subsequently measured. The results indicated that Ni refined the microstructure of the solder matrix and induced the formation of Ni3Sn4 intermetallic phase, and that the size and volume fraction of Ni3Sn4 were positively correlated to the Ni content. The optimal concentration of Ni to enhance the tensile strength of the alloy was 0.1 wt.%, but the elongation of the alloy was inversely correlated to the Ni content. The addition of Ni contributed positively to the melting temperature and wetting behavior of the alloy, whereas no significant change in the electrical resistivity of Sn58Bi-xNi was detected. In addition, Ni increased the thickness of the intermetallic layer at the interface, and only monoclinic eta-Cu6Sn5 phase was present at the intermetallic layer. Nevertheless, the intermetallic phase of this research was dissimilar from the findings of existing literature. (C) 2015 Elsevier Ltd. All tights reserved. Elsevier 2015 Article PeerReviewed Kanlayasiri, Kannachai and Ariga, Tadashi (2015) Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate. Materials & Design, 86. pp. 371-378. ISSN 0261-3069 https://doi.org/10.1016/j.matdes.2015.07.108 doi:10.1016/j.matdes.2015.07.108
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic Q Science (General)
spellingShingle Q Science (General)
Kanlayasiri, Kannachai
Ariga, Tadashi
Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
description The aims of this research are to investigate the effects of Ni on the physical properties of Sn58Bi-xNi lead-free solder, and to examine its interfacial reaction with the copper substrate. In the experiments, four concentrations of Ni (i.e. 0.05, 0.1, 0.5 and 1.0 wt.%) were individually added into Sn58Bi and their respective microstructure, tensile strength, elongation, melting temperature, wettability and electrical resistivity of Sn58Bi-xNi were subsequently measured. The results indicated that Ni refined the microstructure of the solder matrix and induced the formation of Ni3Sn4 intermetallic phase, and that the size and volume fraction of Ni3Sn4 were positively correlated to the Ni content. The optimal concentration of Ni to enhance the tensile strength of the alloy was 0.1 wt.%, but the elongation of the alloy was inversely correlated to the Ni content. The addition of Ni contributed positively to the melting temperature and wetting behavior of the alloy, whereas no significant change in the electrical resistivity of Sn58Bi-xNi was detected. In addition, Ni increased the thickness of the intermetallic layer at the interface, and only monoclinic eta-Cu6Sn5 phase was present at the intermetallic layer. Nevertheless, the intermetallic phase of this research was dissimilar from the findings of existing literature. (C) 2015 Elsevier Ltd. All tights reserved.
format Article
author Kanlayasiri, Kannachai
Ariga, Tadashi
author_facet Kanlayasiri, Kannachai
Ariga, Tadashi
author_sort Kanlayasiri, Kannachai
title Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
title_short Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
title_full Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
title_fullStr Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
title_full_unstemmed Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
title_sort physical properties of sn58bi-xni lead-free solder and its interfacial reaction with copper substrate
publisher Elsevier
publishDate 2015
url http://eprints.um.edu.my/16233/
https://doi.org/10.1016/j.matdes.2015.07.108
_version_ 1654960671113084928
score 13.244367

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