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In-depth study and characterization of insulated Cu wire ball bonding

The increasing market demand for higher pin counts and more chips functionality poses challenges in conventional wire bonding process. The novel insulated Cu wire technology offer potential solution for fine and ultra fine pitch wire bonding as the insulator coating on the bare wire prevents wires...

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Main Authors: Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Muhammad, F.
Format: Conference or Workshop Item
Language:English
Published: 2013
Subjects:
T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.um.edu.my/15611/1/0001.pdf
http://eprints.um.edu.my/15611/
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spelling my.um.eprints.156112016-02-24T01:04:28Z http://eprints.um.edu.my/15611/ In-depth study and characterization of insulated Cu wire ball bonding Leong, H.Y. Yap, B.K. Navas, K. Mohd Rusli, I. Tan, L.C. Muhammad, F. T Technology (General) TK Electrical engineering. Electronics Nuclear engineering The increasing market demand for higher pin counts and more chips functionality poses challenges in conventional wire bonding process. The novel insulated Cu wire technology offer potential solution for fine and ultra fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous studies focused on insulated Au ball bonding. This paper presents in-depth process characterization study on 0.8 mil insulated Cu wire ball bonding on thermally enhanced BGA package with 29 x 29 mm body size via existing available wire bonder to understand the Free Air Ball (FAB) and ball formation characteristics. The study shows that insulated Cu bonding demonstrated comparable performances to bare Cu wire bonding at TO and after subjected to isothermal aging 175°C up to 1008 hours. The effect of Electric Flame Off (EFO) setting and ball bonding key responses (ball shear, wire pull, intermetallic formation, Al splash and Al remnant) are presented in this paper. 2013 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.um.edu.my/15611/1/0001.pdf Leong, H.Y. and Yap, B.K. and Navas, K. and Mohd Rusli, I. and Tan, L.C. and Muhammad, F. (2013) In-depth study and characterization of insulated Cu wire ball bonding. In: 1st International Conference on the Science & Engineering of Materials , 13-14 November 2013, Sunway Putra Hotel, Kuala Lumpur, Malaysia.
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
language English
topic T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
spellingShingle T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Leong, H.Y.
Yap, B.K.
Navas, K.
Mohd Rusli, I.
Tan, L.C.
Muhammad, F.
In-depth study and characterization of insulated Cu wire ball bonding
description The increasing market demand for higher pin counts and more chips functionality poses challenges in conventional wire bonding process. The novel insulated Cu wire technology offer potential solution for fine and ultra fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous studies focused on insulated Au ball bonding. This paper presents in-depth process characterization study on 0.8 mil insulated Cu wire ball bonding on thermally enhanced BGA package with 29 x 29 mm body size via existing available wire bonder to understand the Free Air Ball (FAB) and ball formation characteristics. The study shows that insulated Cu bonding demonstrated comparable performances to bare Cu wire bonding at TO and after subjected to isothermal aging 175°C up to 1008 hours. The effect of Electric Flame Off (EFO) setting and ball bonding key responses (ball shear, wire pull, intermetallic formation, Al splash and Al remnant) are presented in this paper.
format Conference or Workshop Item
author Leong, H.Y.
Yap, B.K.
Navas, K.
Mohd Rusli, I.
Tan, L.C.
Muhammad, F.
author_facet Leong, H.Y.
Yap, B.K.
Navas, K.
Mohd Rusli, I.
Tan, L.C.
Muhammad, F.
author_sort Leong, H.Y.
title In-depth study and characterization of insulated Cu wire ball bonding
title_short In-depth study and characterization of insulated Cu wire ball bonding
title_full In-depth study and characterization of insulated Cu wire ball bonding
title_fullStr In-depth study and characterization of insulated Cu wire ball bonding
title_full_unstemmed In-depth study and characterization of insulated Cu wire ball bonding
title_sort in-depth study and characterization of insulated cu wire ball bonding
publishDate 2013
url http://eprints.um.edu.my/15611/1/0001.pdf
http://eprints.um.edu.my/15611/
_version_ 1643690090574118912
score 13.211869

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