Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim
In this project, the hole mobility enhancement of PMOS are studied using SiGe technology. Silicon Germanium (SiGe) are used to increase drive current or hole mobility in the drain and source region. The performance improvements of devices with a gate length of 0.9 urn, 0.8 \im and 0.7 \im were consi...
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2009
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my.uitm.ir.477002022-07-06T03:02:12Z https://ir.uitm.edu.my/id/eprint/47700/ Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim Zoolfakar, Ahmad Sabirin Hashim, Hashimah Electricity Electric apparatus and materials. Electric circuits. Electric networks In this project, the hole mobility enhancement of PMOS are studied using SiGe technology. Silicon Germanium (SiGe) are used to increase drive current or hole mobility in the drain and source region. The performance improvements of devices with a gate length of 0.9 urn, 0.8 \im and 0.7 \im were considered. The first part of this project is reviewed about the effect of using SiGe in PMOS process to calculate the mobility. 100% of mobility enhancement using SiGe was observed compared to conventional PMOS SiGe. The second part covers the characteristics for variation of SiGe thickness. Therefore, using SiGe is an efficient method for improving PMOS device performance. 2009 Research Reports NonPeerReviewed text en https://ir.uitm.edu.my/id/eprint/47700/1/47700.pdf Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim. (2009) [Research Reports] (Unpublished) |
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Electricity Electric apparatus and materials. Electric circuits. Electric networks Zoolfakar, Ahmad Sabirin Hashim, Hashimah Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim |
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In this project, the hole mobility enhancement of PMOS are studied using SiGe technology. Silicon Germanium (SiGe) are used to increase drive current or hole mobility in the drain and source region. The performance improvements of devices with a gate length of 0.9 urn, 0.8 \im and 0.7 \im were considered. The first part of this project is reviewed about the effect of using SiGe in PMOS process to calculate the mobility. 100% of mobility enhancement using SiGe was observed compared to conventional PMOS SiGe. The second part covers the characteristics for variation of SiGe thickness. Therefore, using SiGe is an efficient method for improving PMOS device performance. |
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Research Reports |
author |
Zoolfakar, Ahmad Sabirin Hashim, Hashimah |
author_facet |
Zoolfakar, Ahmad Sabirin Hashim, Hashimah |
author_sort |
Zoolfakar, Ahmad Sabirin |
title |
Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim |
title_short |
Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim |
title_full |
Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim |
title_fullStr |
Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim |
title_full_unstemmed |
Holes mobility enhancement using strained silicon, SiGe technology / Ahmad Sabirin Zoolfakar and Hashimah Hashim |
title_sort |
holes mobility enhancement using strained silicon, sige technology / ahmad sabirin zoolfakar and hashimah hashim |
publishDate |
2009 |
url |
https://ir.uitm.edu.my/id/eprint/47700/1/47700.pdf https://ir.uitm.edu.my/id/eprint/47700/ |
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1738513912602558464 |
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13.211869 |