Steady-state structural analysis on copper and gold wire bonding using ANSYS : article / Suraya Khalid
The aim for this analysis is to perform simulation and steady-state analysis in structural discipline on wire bonding for various forces and pressure loading on both copper (Cu) and gold (Au) materials. This analysis will consider the size, temperature and properties of each material which resulting...
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| Format: | Article |
| Language: | English |
| Published: |
2012
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| Online Access: | https://ir.uitm.edu.my/id/eprint/37524/1/37524.PDF https://ir.uitm.edu.my/id/eprint/37524/ |
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