Conceptualization of a hybrid machine combining Laser Beam Micro Machining (LBMM) and Micro Electrical Discharge Machining (Micro-EDM) in a single setup
The utilization of hybrid laser beam micromachining (LBMM) in conjunction with micro electrical discharge machining (μEDM) has gained widespread popularity due to its ability to improve material removal rates and enhance surface quality. Typically, these processes occur on separate machines, re...
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Main Authors: | , |
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Format: | Proceeding Paper |
Language: | English English |
Published: |
IEEE Xplore
2024
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Subjects: | |
Online Access: | http://irep.iium.edu.my/115951/1/IEEE_Wan.pdf http://irep.iium.edu.my/115951/7/Conceptualization%20of%20a%20Hybrid%20Machine-complete.pdf http://irep.iium.edu.my/115951/ https://ieeexplore.ieee.org/document/10652479 |
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Summary: | The utilization of hybrid laser beam micromachining
(LBMM) in conjunction with micro electrical discharge
machining (μEDM) has gained widespread popularity due to
its ability to improve material removal rates and enhance
surface quality. Typically, these processes occur on separate
machines, resulting in drawbacks such as time loss during
workpiece transfer, potential misalignment issues, and
increased risks of sample damage during the transfer. This
research provides a system and method for a two-step
sequential machining process of LBMM and μEDM that allows
the workpiece to remain at the same location for both
processes. A LBMM process is used for drilling a rough blind
hole, followed by μEDM for the finishing process. The
workpiece is fixed and positioned in the μEDM workstation. A
microscopic camera, which is mounted on the μEDM machine,
is used to provide common coordinate position data for the
laser and μEDM machine. This coordinate is used by the
μEDM machine to position the electrode perfectly on top of
LBMM hole before machining. The results suggest that
LBMM-μEDM machining can reduce machining time while
achieving good hole quality and repeatability. The hybrid
sequential process significantly reduces drilling time, being
about 1.55 times faster than the pure μEDM method. However,
the findings also indicate that it is not necessary to use LBMM-
μEDM for low aspect ratio holes. This concept enables the
workpiece to stay in one position throughout both processes,
eliminating any time loss and damage during transfer, as well
as avoiding misalignment issues. |
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