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Thermal Analysis of VLSI System: A Simulation Study

Smaller size of Very Large Scale Integrated (VLSI) System nowadays increases the on chip power densities causing the rise of temperature in the system. The high temperature produced will eventually affects the clock frequency of the system and changes the timing setup of the component. These lead...

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Main Author: Nik Ab Rashid, Nik Nur Nailini
Format: Final Year Project
Language:English
Published: IRC 2016
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://utpedia.utp.edu.my/17081/1/Nik%20Nur%20Nailini%20Binti%20Nik%20Ab%20Rashid%20-%20Dissertation.pdf
http://utpedia.utp.edu.my/17081/
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spelling my-utp-utpedia.170812017-01-25T09:34:39Z http://utpedia.utp.edu.my/17081/ Thermal Analysis of VLSI System: A Simulation Study Nik Ab Rashid, Nik Nur Nailini TK Electrical engineering. Electronics Nuclear engineering Smaller size of Very Large Scale Integrated (VLSI) System nowadays increases the on chip power densities causing the rise of temperature in the system. The high temperature produced will eventually affects the clock frequency of the system and changes the timing setup of the component. These lead to lowering the performance and reliability of the system. Due to the negative effects of the high temperature, designers have to determine the thermal profile of the systems in order to understand the temperature distribution, the leakage reduction and estimate the power distribution of the system. This research focuses on analyzing the thermal profile of a VLSI system under steady state condition using numerical techniques and simulation. For the numerical techniques, the governing heat equation for a two-dimensional (2D) model was solved using Finite Difference Method (FDM), Gauss-Seidel (GS) and Successive Over Relaxation (SOR) methods. Simulation based on ANSYS simulator has been conducted for validation purpose. Most commonly material used in VLSI system which is Silicon (Si) is tested under adiabatic condition. The results for numerical techniques and the simulation are compared. SOR method shows better results in terms of number of iterations and the computational time compared to GS method in solving the governing heat equation. Both methods have the same maximum temperature and these temperatures are comparable with the result obtained by using ANSYS. IRC 2016-01 Final Year Project NonPeerReviewed application/pdf en http://utpedia.utp.edu.my/17081/1/Nik%20Nur%20Nailini%20Binti%20Nik%20Ab%20Rashid%20-%20Dissertation.pdf Nik Ab Rashid, Nik Nur Nailini (2016) Thermal Analysis of VLSI System: A Simulation Study. IRC, Universiti Teknologi PETRONAS. (Submitted)
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Electronic and Digitized Intellectual Asset
url_provider http://utpedia.utp.edu.my/
language English
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Nik Ab Rashid, Nik Nur Nailini
Thermal Analysis of VLSI System: A Simulation Study
description Smaller size of Very Large Scale Integrated (VLSI) System nowadays increases the on chip power densities causing the rise of temperature in the system. The high temperature produced will eventually affects the clock frequency of the system and changes the timing setup of the component. These lead to lowering the performance and reliability of the system. Due to the negative effects of the high temperature, designers have to determine the thermal profile of the systems in order to understand the temperature distribution, the leakage reduction and estimate the power distribution of the system. This research focuses on analyzing the thermal profile of a VLSI system under steady state condition using numerical techniques and simulation. For the numerical techniques, the governing heat equation for a two-dimensional (2D) model was solved using Finite Difference Method (FDM), Gauss-Seidel (GS) and Successive Over Relaxation (SOR) methods. Simulation based on ANSYS simulator has been conducted for validation purpose. Most commonly material used in VLSI system which is Silicon (Si) is tested under adiabatic condition. The results for numerical techniques and the simulation are compared. SOR method shows better results in terms of number of iterations and the computational time compared to GS method in solving the governing heat equation. Both methods have the same maximum temperature and these temperatures are comparable with the result obtained by using ANSYS.
format Final Year Project
author Nik Ab Rashid, Nik Nur Nailini
author_facet Nik Ab Rashid, Nik Nur Nailini
author_sort Nik Ab Rashid, Nik Nur Nailini
title Thermal Analysis of VLSI System: A Simulation Study
title_short Thermal Analysis of VLSI System: A Simulation Study
title_full Thermal Analysis of VLSI System: A Simulation Study
title_fullStr Thermal Analysis of VLSI System: A Simulation Study
title_full_unstemmed Thermal Analysis of VLSI System: A Simulation Study
title_sort thermal analysis of vlsi system: a simulation study
publisher IRC
publishDate 2016
url http://utpedia.utp.edu.my/17081/1/Nik%20Nur%20Nailini%20Binti%20Nik%20Ab%20Rashid%20-%20Dissertation.pdf
http://utpedia.utp.edu.my/17081/
_version_ 1739832342317367296
score 13.211869

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