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Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board

High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The junction temperature is what really matters for component functionality and reliability. This study presents a u...

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Bibliographic Details
Main Author: Mashadov, Guwanch
Format: Final Year Project
Language:English
English
Published: Universiti Teknologi Petronas 2013
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://utpedia.utp.edu.my/13467/1/guwanch.pdf
http://utpedia.utp.edu.my/13467/2/guwanch.pdf
http://utpedia.utp.edu.my/13467/
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spelling my-utp-utpedia.134672017-01-25T09:38:11Z http://utpedia.utp.edu.my/13467/ Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board Mashadov, Guwanch TK Electrical engineering. Electronics Nuclear engineering High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The junction temperature is what really matters for component functionality and reliability. This study presents a useful analysis on mathematical approach which can be implemented to predict thermal behavior in Integrated Circuit (IC). The problem could be modeled as heat conduction equation. In this study, numerical approaches based on implicit scheme and Arithmetic Mean (AM) iterative method will be applied to solve the governing heat conduction equation. From the numerical results obtained, it shows that AM method solves the governing heat conduction equation with minimum number of iterations and fastest computational time compared to the Gauss-Seidel (GS) method. It is in design phase when simulations and modeling are carried out to ensure high performance and reliability. The availability of thermal analysis tool for maximum temperature prediction would be of great value to designers of power device ICs. Universiti Teknologi Petronas 2013-12 Final Year Project NonPeerReviewed application/pdf en http://utpedia.utp.edu.my/13467/1/guwanch.pdf application/pdf en http://utpedia.utp.edu.my/13467/2/guwanch.pdf Mashadov, Guwanch (2013) Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board. Universiti Teknologi Petronas. (Unpublished)
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Electronic and Digitized Intellectual Asset
url_provider http://utpedia.utp.edu.my/
language English
English
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Mashadov, Guwanch
Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board
description High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The junction temperature is what really matters for component functionality and reliability. This study presents a useful analysis on mathematical approach which can be implemented to predict thermal behavior in Integrated Circuit (IC). The problem could be modeled as heat conduction equation. In this study, numerical approaches based on implicit scheme and Arithmetic Mean (AM) iterative method will be applied to solve the governing heat conduction equation. From the numerical results obtained, it shows that AM method solves the governing heat conduction equation with minimum number of iterations and fastest computational time compared to the Gauss-Seidel (GS) method. It is in design phase when simulations and modeling are carried out to ensure high performance and reliability. The availability of thermal analysis tool for maximum temperature prediction would be of great value to designers of power device ICs.
format Final Year Project
author Mashadov, Guwanch
author_facet Mashadov, Guwanch
author_sort Mashadov, Guwanch
title Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board
title_short Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board
title_full Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board
title_fullStr Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board
title_full_unstemmed Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board
title_sort implementation of arithmetic mean method on determination of peak junction temperature of semiconductor device on printed circuit board
publisher Universiti Teknologi Petronas
publishDate 2013
url http://utpedia.utp.edu.my/13467/1/guwanch.pdf
http://utpedia.utp.edu.my/13467/2/guwanch.pdf
http://utpedia.utp.edu.my/13467/
_version_ 1739831900089876480
score 13.211869

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