Copper nanoparticles coating on FTO with improved adhesion using direct and pulse electrodeposition techniques from a simple copper sulphate solution
Copper (Cu) metal nanoparticles were deposited onto FTO glass using the electrodeposition method. The precursor used was CuSO4 ⋅5H2 O with Na2 SO4 as the inorganic additive. The formation of Cu was characterized using field emission scanning electron microscopy (FESEM), energy-dispersive X-ray spect...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2023
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| Online Access: | http://journalarticle.ukm.my/22886/1/SML%204.pdf http://journalarticle.ukm.my/22886/ https://www.ukm.my/jsm/english_journals/vol52num8_2023/contentsVol52num8_2023.html |
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