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Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap

Printed circuit boards (PCBs) are the basic components of electrical and electronic devices. E-waste management is challenging to implement due to accompanying difficulties and danger. Valuable metals and copper (Cu) are primarily recycled through various methods in the treatment of waste PCB. A lar...

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Main Authors: Nor Yuliana Yuhana,, Nur Hidayatul Nazirah Kamarudin,
Format: Article
Language:English
Published: Penerbit Universiti Kebangsaan Malaysia 2022
Online Access:http://journalarticle.ukm.my/21124/1/Jk_20.pdf
http://journalarticle.ukm.my/21124/
https://www.ukm.my/jkukm/volume-3406-2022/
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spelling my-ukm.journal.211242023-02-14T10:12:46Z http://journalarticle.ukm.my/21124/ Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap Nor Yuliana Yuhana, Nur Hidayatul Nazirah Kamarudin, Printed circuit boards (PCBs) are the basic components of electrical and electronic devices. E-waste management is challenging to implement due to accompanying difficulties and danger. Valuable metals and copper (Cu) are primarily recycled through various methods in the treatment of waste PCB. A large number of non-metals materials in PCBs are disposed of through combustion or in landfill, resulting in secondary pollution and resource waste. To reduce the amount of waste non-metallic PCB (NMPCB) and the influences toward environment, recent studies focused on the usage of NMPCB as filler to replace raw material. NMPCB as filler seems to have a good interaction with the raw materials and thus can enhance the strength of the newly formed product. In our study, we focused on developing new NMPCB added with waste NMPCB. Commercial NMPCBs are often a flat laminated composite comprising non-conductive substrate materials. Hence, pre-treatment methods to remove metals, especially Cu, must be investigated. The present study attempted to remove the Cu layer on PCB by using chemical and physical methods. The untreated and Cu removed PCB residues were characterized using X-ray diffraction (XRD), scanning electron microscopy, and infrared spectroscopy (FTIR) for the determination of structural and functional groups and hydrophobicity test. XRD analysis indicated that the Cu in untreated PCB was successfully removed using physical and chemical methods. Penerbit Universiti Kebangsaan Malaysia 2022 Article PeerReviewed application/pdf en http://journalarticle.ukm.my/21124/1/Jk_20.pdf Nor Yuliana Yuhana, and Nur Hidayatul Nazirah Kamarudin, (2022) Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap. Jurnal Kejuruteraan, 34 (6). pp. 1199-1207. ISSN 0128-0198 https://www.ukm.my/jkukm/volume-3406-2022/
institution Universiti Kebangsaan Malaysia
building Tun Sri Lanang Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Kebangsaan Malaysia
content_source UKM Journal Article Repository
url_provider http://journalarticle.ukm.my/
language English
description Printed circuit boards (PCBs) are the basic components of electrical and electronic devices. E-waste management is challenging to implement due to accompanying difficulties and danger. Valuable metals and copper (Cu) are primarily recycled through various methods in the treatment of waste PCB. A large number of non-metals materials in PCBs are disposed of through combustion or in landfill, resulting in secondary pollution and resource waste. To reduce the amount of waste non-metallic PCB (NMPCB) and the influences toward environment, recent studies focused on the usage of NMPCB as filler to replace raw material. NMPCB as filler seems to have a good interaction with the raw materials and thus can enhance the strength of the newly formed product. In our study, we focused on developing new NMPCB added with waste NMPCB. Commercial NMPCBs are often a flat laminated composite comprising non-conductive substrate materials. Hence, pre-treatment methods to remove metals, especially Cu, must be investigated. The present study attempted to remove the Cu layer on PCB by using chemical and physical methods. The untreated and Cu removed PCB residues were characterized using X-ray diffraction (XRD), scanning electron microscopy, and infrared spectroscopy (FTIR) for the determination of structural and functional groups and hydrophobicity test. XRD analysis indicated that the Cu in untreated PCB was successfully removed using physical and chemical methods.
format Article
author Nor Yuliana Yuhana,
Nur Hidayatul Nazirah Kamarudin,
spellingShingle Nor Yuliana Yuhana,
Nur Hidayatul Nazirah Kamarudin,
Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap
author_facet Nor Yuliana Yuhana,
Nur Hidayatul Nazirah Kamarudin,
author_sort Nor Yuliana Yuhana,
title Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap
title_short Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap
title_full Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap
title_fullStr Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap
title_full_unstemmed Comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap
title_sort comparison of physical and chemical method for removing copper from non-metallic printed circuit board scrap
publisher Penerbit Universiti Kebangsaan Malaysia
publishDate 2022
url http://journalarticle.ukm.my/21124/1/Jk_20.pdf
http://journalarticle.ukm.my/21124/
https://www.ukm.my/jkukm/volume-3406-2022/
_version_ 1758579336012627968
score 13.211869

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