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Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint

The constant load behaviour of SAC305 solder joint with addition of carbon nanotube (CNT), exposed to shock wave condition was investigated. Formulated SAC305-CNT solder pastes with 0.04 wt. % CNT were manually printed to the printed circuit board (PCB) with copper surface finish to form solder jo...

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Main Authors: Norliza Ismail,, Azman Jalar,, Wan Yusmawati Wan Yusoff,, Nur Shafiqa Safee,, Ariffin Ismail,
Format: Article
Language:English
Published: Penerbit Universiti Kebangsaan Malaysia 2020
Online Access:http://journalarticle.ukm.my/16168/1/15.pdf
http://journalarticle.ukm.my/16168/
https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html
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spelling my-ukm.journal.161682021-02-13T13:25:16Z http://journalarticle.ukm.my/16168/ Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint Norliza Ismail, Azman Jalar, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, Ariffin Ismail, The constant load behaviour of SAC305 solder joint with addition of carbon nanotube (CNT), exposed to shock wave condition was investigated. Formulated SAC305-CNT solder pastes with 0.04 wt. % CNT were manually printed to the printed circuit board (PCB) with copper surface finish to form solder joint. The solder joint was exposed to the shock wave condition via open field blast air test using Trinitrotoluene (TNT) explosive. Nanoindentation approach was used to determine the constant load behavior of the SAC305-CNT solder joint under shock wave condition. The results showed that addition of CNT reduced the indentation depth of SAC305 solder joint at 10 mN peak load for blast test sample and control sample. Indentation depth displacement of SAC305-CNT solder joint for blast test sample and control sample were reduced about ~ 42 and ~56%, respectively, if compared to the SAC305 solder joint for blast test sample and control sample. SAC305-CNT solder joint was experienced minimal changes of stress exponent when exposed to the shock wave. The existence of CNT in the solder joint slows down the depth displacement due to constant load. Penerbit Universiti Kebangsaan Malaysia 2020-12 Article PeerReviewed application/pdf en http://journalarticle.ukm.my/16168/1/15.pdf Norliza Ismail, and Azman Jalar, and Wan Yusmawati Wan Yusoff, and Nur Shafiqa Safee, and Ariffin Ismail, (2020) Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint. Sains Malaysiana, 49 (12). pp. 3037-3044. ISSN 0126-6039 https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html
institution Universiti Kebangsaan Malaysia
building Tun Sri Lanang Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Kebangsaan Malaysia
content_source UKM Journal Article Repository
url_provider http://journalarticle.ukm.my/
language English
description The constant load behaviour of SAC305 solder joint with addition of carbon nanotube (CNT), exposed to shock wave condition was investigated. Formulated SAC305-CNT solder pastes with 0.04 wt. % CNT were manually printed to the printed circuit board (PCB) with copper surface finish to form solder joint. The solder joint was exposed to the shock wave condition via open field blast air test using Trinitrotoluene (TNT) explosive. Nanoindentation approach was used to determine the constant load behavior of the SAC305-CNT solder joint under shock wave condition. The results showed that addition of CNT reduced the indentation depth of SAC305 solder joint at 10 mN peak load for blast test sample and control sample. Indentation depth displacement of SAC305-CNT solder joint for blast test sample and control sample were reduced about ~ 42 and ~56%, respectively, if compared to the SAC305 solder joint for blast test sample and control sample. SAC305-CNT solder joint was experienced minimal changes of stress exponent when exposed to the shock wave. The existence of CNT in the solder joint slows down the depth displacement due to constant load.
format Article
author Norliza Ismail,
Azman Jalar,
Wan Yusmawati Wan Yusoff,
Nur Shafiqa Safee,
Ariffin Ismail,
spellingShingle Norliza Ismail,
Azman Jalar,
Wan Yusmawati Wan Yusoff,
Nur Shafiqa Safee,
Ariffin Ismail,
Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint
author_facet Norliza Ismail,
Azman Jalar,
Wan Yusmawati Wan Yusoff,
Nur Shafiqa Safee,
Ariffin Ismail,
author_sort Norliza Ismail,
title Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint
title_short Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint
title_full Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint
title_fullStr Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint
title_full_unstemmed Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint
title_sort effect of shock wave on constant load behaviour of pb-free/cnt solder joint
publisher Penerbit Universiti Kebangsaan Malaysia
publishDate 2020
url http://journalarticle.ukm.my/16168/1/15.pdf
http://journalarticle.ukm.my/16168/
https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html
_version_ 1691734025089056768
score 13.211869

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