Search Results - "Reflow"

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  1. 1
    Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system

    Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system by Nor Adhila Muhammad, Badariah Bais, Ibrahim Ahmad

    Published 2014
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  2. 2
    Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system

    Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system by Adhila Muhammad N., Bais B., Ahmad I.

    Published 2023
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  3. 3
    Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow

    Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow by Siti Rabiatull Aisha, Idris, Siti, Zuleikha, Zetty Akhtar, Abd Malek

    Published 2016
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    Conference or Workshop Item
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  4. 4
    Effect of Reflow Soldering Profile on Intermetallic Compound Formation

    Effect of Reflow Soldering Profile on Intermetallic Compound Formation by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman

    Published 2015
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  5. 5
    Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.

    Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. by Muhammad Iqbal Ahmad

    Published 2021
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  6. 6
    Effect of Reflow Profile on Intermetallic Compound Formation

    Effect of Reflow Profile on Intermetallic Compound Formation by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman

    Published 2013
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  7. 7
    Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates

    Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates by Muhammad N.A., Bais B.H., Ahmad I., Isnin A.

    Published 2023
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  8. 8
    Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate

    Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate by M.A., Rabiatul Adawiyah, S.A., Amirul, O., Saliza Azlina, H., Syafiq

    Published 2020
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  9. 9
    Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number

    Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number by Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Zahari, Nur Ismarrubie, Baserfalak, F.

    Published 2014
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  10. 10
    Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number

    Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number by Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Zahari, Nur Ismarrubie, Baserfalak, F.

    Published 2014
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  11. 11
    Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process

    Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process by Muhammad Rafiq, Mohammad Sabri

    Published 2018
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    Monograph
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  12. 12
    Substrate Warpage analysis During Solger Reflow Process

    Substrate Warpage analysis During Solger Reflow Process by Beh, Keh Shin

    Published 2004
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    Thesis
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  13. 13
    Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering

    Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering by Chong, Jia Jun

    Published 2019
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    Monograph
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  14. 14
    Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions

    Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions by Lee , Liu Mei

    Published 2013
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  15. 15
    Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process

    Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process by Raja Gobal, Hehgeraj

    Published 2022
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  16. 16
    Reflow of Sn-3.8Ag-O.7Cu solder on Ni substrate in presence of Mo nanoparticles

    Reflow of Sn-3.8Ag-O.7Cu solder on Ni substrate in presence of Mo nanoparticles by Mahdavifard, M.H., Haseeb, A.S. Md. Abdul, Arafat, M.M.

    Published 2013
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  17. 17
    Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish

    Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish by Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak

    Published 2016
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  18. 18
    Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

    Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds by Haseeb, A.S. Md. Abdul, Arafat, M.M., Johan, M.R.

    Published 2012
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  19. 19
    Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

    Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints by Goh, Y., Haseeb, A.S. Md. Abdul, Liew, H.L., Sabri, M.F.M.

    Published 2015
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  20. 20
    The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg

    The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg by M.A., Rabiatul Adawiyah, A.B., M. Hafiz, O., Saliza Azlina, J., Zolhafizi, W.M., Wan Nur Azrina, O., Shahrul Azmir

    Published 2019
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