Search Results - "Ball grid array (BGA)"

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  1. 1
    Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

    Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA) by Muhammad Nubli, Zulkifli

    Published 2010
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  2. 2
    Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

    Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component by Tan, Chun Huat

    Published 2014
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  3. 3
    Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages

    Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages by Lim, Chong Hooi

    Published 2017
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  4. 4
    Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing

    Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing by Ng , Qian Qing

    Published 2024
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  5. 5
    Determination of thermal expansion coefficient for ball grid array using digital image correlation

    Determination of thermal expansion coefficient for ball grid array using digital image correlation by Kong, Yat Sheng, Crosbie, Liam

    Published 2022
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  6. 6
    Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS

    Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS by Lau, Chun Sean, Abdullah, M. Z., Mujeebu, M. Abdul, Yusof, N. Md

    Published 2014
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  7. 7
    Detecting head in pillow defect (HIP) by using deep learning and image processing technique

    Detecting head in pillow defect (HIP) by using deep learning and image processing technique by Tan, Wei Jin

    Published 2021
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  8. 8
    Temperature cycling analysis for ball grid array package using finite element analysis

    Temperature cycling analysis for ball grid array package using finite element analysis by Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Prof. Dr., Ghulam, Abdul Quadir

    Published 2011
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  9. 9
    Study of interfacial reactions between lead-free solders and immersion silver finish

    Study of interfacial reactions between lead-free solders and immersion silver finish by Oshaghi, Safoura

    Published 2008
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  10. 10
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / Chew Chee Sean

    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / Chew Chee Sean by Chew, Chee Sean

    Published 2011
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  11. 11
    Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests

    Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests by Kar Y.B., Hui T.C., Agileswari R., Lo C.

    Published 2023
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  12. 12
    Characterization study for polymer core solder balls under AC and TC reliability test

    Characterization study for polymer core solder balls under AC and TC reliability test by Tan C.H., Yap B.K., Tan C.Y.

    Published 2023
    Conference Paper
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