Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass
In IC and optical manufacturing some of the materials that are polished after grinding are Si, Ge, Pyrex and BK 7 glass. In the case of Al, Cu and W, they are deposited and are CMP polished. The polishing process used on IC wafers is chemical mechanical polishing (CMP) that has in built facilities f...
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Elsevier B.V.
2004
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| Online Access: | http://eprints.utm.my/7044/ http://dx.doi.org/10.1016/j.jmatprotec.2003.11.056 |
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| author | Venkatesh, Vasisht C. Sudin, Izman Mahadevan, S. C. |
| author_facet | Venkatesh, Vasisht C. Sudin, Izman Mahadevan, S. C. |
| author_sort | Venkatesh, Vasisht C. |
| building | UTM Library |
| collection | Institutional Repository |
| content_provider | Universiti Teknologi Malaysia |
| content_source | UTM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | In IC and optical manufacturing some of the materials that are polished after grinding are Si, Ge, Pyrex and BK 7 glass. In the case of Al, Cu and W, they are deposited and are CMP polished. The polishing process used on IC wafers is chemical mechanical polishing (CMP) that has in built facilities for planarizing as well. There are two major applications in ultralarge scale integrated circuits (ULSI) manufacturing. One application is to smooth surface topography of interlevel dielectric (ILD), e.g. doped oxide or silicon oxide and another application is to remove excess Cu material to produce inlaid metal structures or isolation trenches. Cu CMP is employed for Cu metallization on oxide layers, which are patterned and etched to form vias, and trenches that are subsequently electroplated to fill with copper. Recent publications indicate evidence of copper undergoing electro-chemical mechanical interactions during polishing |
| format | Article |
| id | my.utm.eprints-7044 |
| institution | Universiti Teknologi Malaysia |
| publishDate | 2004 |
| publisher | Elsevier B.V. |
| record_format | eprints |
| spelling | my.utm.eprints-70442017-10-22T07:23:06Z http://eprints.utm.my/7044/ Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass Venkatesh, Vasisht C. Sudin, Izman Mahadevan, S. C. TJ Mechanical engineering and machinery In IC and optical manufacturing some of the materials that are polished after grinding are Si, Ge, Pyrex and BK 7 glass. In the case of Al, Cu and W, they are deposited and are CMP polished. The polishing process used on IC wafers is chemical mechanical polishing (CMP) that has in built facilities for planarizing as well. There are two major applications in ultralarge scale integrated circuits (ULSI) manufacturing. One application is to smooth surface topography of interlevel dielectric (ILD), e.g. doped oxide or silicon oxide and another application is to remove excess Cu material to produce inlaid metal structures or isolation trenches. Cu CMP is employed for Cu metallization on oxide layers, which are patterned and etched to form vias, and trenches that are subsequently electroplated to fill with copper. Recent publications indicate evidence of copper undergoing electro-chemical mechanical interactions during polishing Elsevier B.V. 2004-06-10 Article PeerReviewed Venkatesh, Vasisht C. and Sudin, Izman and Mahadevan, S. C. (2004) Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass. Journal of Materials Processing Technology, 149 (1-3). pp. 493-498. ISSN 09240136 http://dx.doi.org/10.1016/j.jmatprotec.2003.11.056 |
| spellingShingle | TJ Mechanical engineering and machinery Venkatesh, Vasisht C. Sudin, Izman Mahadevan, S. C. Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass |
| title | Electro-chemical mechanical polishing of copper
and chemical mechanical polishing of glass |
| title_full | Electro-chemical mechanical polishing of copper
and chemical mechanical polishing of glass |
| title_fullStr | Electro-chemical mechanical polishing of copper
and chemical mechanical polishing of glass |
| title_full_unstemmed | Electro-chemical mechanical polishing of copper
and chemical mechanical polishing of glass |
| title_short | Electro-chemical mechanical polishing of copper
and chemical mechanical polishing of glass |
| title_sort | electro-chemical mechanical polishing of copper
and chemical mechanical polishing of glass |
| topic | TJ Mechanical engineering and machinery |
| url | http://eprints.utm.my/7044/ http://dx.doi.org/10.1016/j.jmatprotec.2003.11.056 |
| url_provider | http://eprints.utm.my/ |