Application of signal analysis techniques for condition monitoring of a wire bonding machine
This paper investigates the technique to monitor the condition of a wire bonding machine that used in the integrated manufacturing (IC) industry. The machine forms the connection between the bonding pad on the die to the contacts of the leadframe. To ensure consistency in the process, defects in the...
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| Format: | Article |
| Language: | en |
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ieee
2000
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| Online Access: | http://eprints.utm.my/2326/1/Ahmad2000__ApplicationOfSignalAnalysisTechniques.pdf http://eprints.utm.my/2326/ |
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| author | Ahmad, Puteri Aidawati Sha'ameri, Ahmad Zuri Sheikh Salleh, Sheikh Hussein Mohd Badar, Omar Mohd Hani, Mohammed Khalil |
| author_facet | Ahmad, Puteri Aidawati Sha'ameri, Ahmad Zuri Sheikh Salleh, Sheikh Hussein Mohd Badar, Omar Mohd Hani, Mohammed Khalil |
| author_sort | Ahmad, Puteri Aidawati |
| building | UTM Library |
| collection | Institutional Repository |
| content_provider | Universiti Teknologi Malaysia |
| content_source | UTM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | This paper investigates the technique to monitor the condition of a wire bonding machine that used in the integrated manufacturing (IC) industry. The machine forms the connection between the bonding pad on the die to the contacts of the leadframe. To ensure consistency in the process, defects in the bondhead subassembly can be monitored from the damping signature. For this purpose, the analysis techniques chosen are the correlation function and power spectrum estimation. Thus, the main objective of this paper is to find the signal analysis technique that can uniquely represent the good from the defective machine signatures
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| format | Article |
| id | my.utm.eprints-2326 |
| institution | Universiti Teknologi Malaysia |
| language | en |
| publishDate | 2000 |
| publisher | ieee |
| record_format | eprints |
| spelling | my.utm.eprints-23262010-06-01T03:02:33Z http://eprints.utm.my/2326/ Application of signal analysis techniques for condition monitoring of a wire bonding machine Ahmad, Puteri Aidawati Sha'ameri, Ahmad Zuri Sheikh Salleh, Sheikh Hussein Mohd Badar, Omar Mohd Hani, Mohammed Khalil TK Electrical engineering. Electronics Nuclear engineering This paper investigates the technique to monitor the condition of a wire bonding machine that used in the integrated manufacturing (IC) industry. The machine forms the connection between the bonding pad on the die to the contacts of the leadframe. To ensure consistency in the process, defects in the bondhead subassembly can be monitored from the damping signature. For this purpose, the analysis techniques chosen are the correlation function and power spectrum estimation. Thus, the main objective of this paper is to find the signal analysis technique that can uniquely represent the good from the defective machine signatures ieee 2000-09-24 Article PeerReviewed application/pdf en http://eprints.utm.my/2326/1/Ahmad2000__ApplicationOfSignalAnalysisTechniques.pdf Ahmad, Puteri Aidawati and Sha'ameri, Ahmad Zuri and Sheikh Salleh, Sheikh Hussein and Mohd Badar, Omar and Mohd Hani, Mohammed Khalil (2000) Application of signal analysis techniques for condition monitoring of a wire bonding machine. TENCON 2000. Proceedings, 2 (3 vol.(xxv+536+614+527) ). pp. 372-376. |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Ahmad, Puteri Aidawati Sha'ameri, Ahmad Zuri Sheikh Salleh, Sheikh Hussein Mohd Badar, Omar Mohd Hani, Mohammed Khalil Application of signal analysis techniques for condition monitoring of a wire bonding machine |
| title | Application of signal analysis techniques for condition monitoring of a wire bonding machine
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| title_full | Application of signal analysis techniques for condition monitoring of a wire bonding machine
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| title_fullStr | Application of signal analysis techniques for condition monitoring of a wire bonding machine
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| title_full_unstemmed | Application of signal analysis techniques for condition monitoring of a wire bonding machine
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| title_short | Application of signal analysis techniques for condition monitoring of a wire bonding machine
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| title_sort | application of signal analysis techniques for condition monitoring of a wire bonding machine |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://eprints.utm.my/2326/1/Ahmad2000__ApplicationOfSignalAnalysisTechniques.pdf http://eprints.utm.my/2326/ |
| url_provider | http://eprints.utm.my/ |