Development of polymer composites using modified, high-structural integrity graphene platelets

Previous studies on polymer/graphene composites have mainly utilized either reduced graphene oxide or graphite nanoplatelets of over 10 nm in thickness. In this study we covalently modified 3-nm thick graphene platelets (GnPs) by the reaction between the GnPs’ epoxide groups and the end-amine groups...

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Main Authors: Jun, Ma, Meng, Qingshi, Zaman, Izzuddin, Zhu, Shenmin, Michelmore, Andrew, Nobuyuki, Kawashima, Wang, Chun H., Kuan, Hsu-Chiang
Format: Article
Language:en
Published: Elsevier 2014
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Online Access:http://eprints.uthm.edu.my/5627/1/AJ%202017%20%28867%29.pdf
http://eprints.uthm.edu.my/5627/
http://dx.doi.org/10.1016/j.compscitech.2013.11.017
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author Jun, Ma
Meng, Qingshi
Zaman, Izzuddin
Zhu, Shenmin
Michelmore, Andrew
Nobuyuki, Kawashima
Wang, Chun H.
Kuan, Hsu-Chiang
author_facet Jun, Ma
Meng, Qingshi
Zaman, Izzuddin
Zhu, Shenmin
Michelmore, Andrew
Nobuyuki, Kawashima
Wang, Chun H.
Kuan, Hsu-Chiang
author_sort Jun, Ma
building UTHM Library
collection Institutional Repository
content_provider Universiti Tun Hussein Onn Malaysia
content_source UTHM Institutional Repository
continent Asia
country Malaysia
description Previous studies on polymer/graphene composites have mainly utilized either reduced graphene oxide or graphite nanoplatelets of over 10 nm in thickness. In this study we covalently modified 3-nm thick graphene platelets (GnPs) by the reaction between the GnPs’ epoxide groups and the end-amine groups of a commercial long-chain surfactant (Mw = 2000), compounded the modified GnPs (m-GnPs) with a model polymer epoxy, and investigated the structure and properties of both m-GnPs and their epoxy composites. A low Raman ID/IG ratio of 0.13 was found for m-GnPs corresponding to high structural integ- rity. A percolation threshold of electrical conductivity was observed at 0.32 vol% m-GnPs, and the 0.98 vol% m-GnPs improved the Young’s modulus, fracture energy release rate and glass transition tem- perature of epoxy by 14%, 387% and 13%, respectively. These significantly improved properties are cred- ited to: (i) the low Raman ID/IG ratio of GnPs, maximizing the structural integrity and thus conductivity, stiffness and strength inherited from its sister graphene, (ii) the low thickness of GnPs, minimizing the damaging effect of the poor through-plane mechanical properties and electrical conductivity of graphene, (iii) the high-molecular weight surfactant, leading to uniformly dispersed GnPs in the matrix, and (iv) a covalently bonded interface between m-GnPs and matrix, more effectively transferring load/electron across interface.
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spelling my.uthm.eprints-56272022-01-17T02:56:35Z http://eprints.uthm.edu.my/5627/ Development of polymer composites using modified, high-structural integrity graphene platelets Jun, Ma Meng, Qingshi Zaman, Izzuddin Zhu, Shenmin Michelmore, Andrew Nobuyuki, Kawashima Wang, Chun H. Kuan, Hsu-Chiang TP1080-1185 Polymers and polymer manufacture TP200-248 Chemicals: Manufacture, use, etc. Previous studies on polymer/graphene composites have mainly utilized either reduced graphene oxide or graphite nanoplatelets of over 10 nm in thickness. In this study we covalently modified 3-nm thick graphene platelets (GnPs) by the reaction between the GnPs’ epoxide groups and the end-amine groups of a commercial long-chain surfactant (Mw = 2000), compounded the modified GnPs (m-GnPs) with a model polymer epoxy, and investigated the structure and properties of both m-GnPs and their epoxy composites. A low Raman ID/IG ratio of 0.13 was found for m-GnPs corresponding to high structural integ- rity. A percolation threshold of electrical conductivity was observed at 0.32 vol% m-GnPs, and the 0.98 vol% m-GnPs improved the Young’s modulus, fracture energy release rate and glass transition tem- perature of epoxy by 14%, 387% and 13%, respectively. These significantly improved properties are cred- ited to: (i) the low Raman ID/IG ratio of GnPs, maximizing the structural integrity and thus conductivity, stiffness and strength inherited from its sister graphene, (ii) the low thickness of GnPs, minimizing the damaging effect of the poor through-plane mechanical properties and electrical conductivity of graphene, (iii) the high-molecular weight surfactant, leading to uniformly dispersed GnPs in the matrix, and (iv) a covalently bonded interface between m-GnPs and matrix, more effectively transferring load/electron across interface. Elsevier 2014 Article PeerReviewed text en http://eprints.uthm.edu.my/5627/1/AJ%202017%20%28867%29.pdf Jun, Ma and Meng, Qingshi and Zaman, Izzuddin and Zhu, Shenmin and Michelmore, Andrew and Nobuyuki, Kawashima and Wang, Chun H. and Kuan, Hsu-Chiang (2014) Development of polymer composites using modified, high-structural integrity graphene platelets. Composites Science and Technology, 91 (NIL). pp. 82-90. ISSN 0266-3538 http://dx.doi.org/10.1016/j.compscitech.2013.11.017
spellingShingle TP1080-1185 Polymers and polymer manufacture
TP200-248 Chemicals: Manufacture, use, etc.
Jun, Ma
Meng, Qingshi
Zaman, Izzuddin
Zhu, Shenmin
Michelmore, Andrew
Nobuyuki, Kawashima
Wang, Chun H.
Kuan, Hsu-Chiang
Development of polymer composites using modified, high-structural integrity graphene platelets
title Development of polymer composites using modified, high-structural integrity graphene platelets
title_full Development of polymer composites using modified, high-structural integrity graphene platelets
title_fullStr Development of polymer composites using modified, high-structural integrity graphene platelets
title_full_unstemmed Development of polymer composites using modified, high-structural integrity graphene platelets
title_short Development of polymer composites using modified, high-structural integrity graphene platelets
title_sort development of polymer composites using modified, high-structural integrity graphene platelets
topic TP1080-1185 Polymers and polymer manufacture
TP200-248 Chemicals: Manufacture, use, etc.
url http://eprints.uthm.edu.my/5627/1/AJ%202017%20%28867%29.pdf
http://eprints.uthm.edu.my/5627/
http://dx.doi.org/10.1016/j.compscitech.2013.11.017
url_provider http://eprints.uthm.edu.my/