Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface

Nanospheres made of organic polymer have been applied to generate various patterning mask in fabricating functional nanostructures. The patterning and generation of semiconductor nanostructures through nanospheres mask provides a potential alternative to the conventional top-down fabrication techniq...

Full description

Saved in:
Bibliographic Details
Main Authors: Yabagi, Jibrin Alhaji, Kimpa, Mohammed Isah, Muhammad, Muhammad Nmaya, Nayan, Nafarizal, Embong, Zaidi, Agam, Mohd Arif
Format: Article
Language:en
Published: UTHM Publisher 2017
Subjects:
Online Access:http://eprints.uthm.edu.my/4852/1/AJ%202017%20%28674%29.pdf
http://eprints.uthm.edu.my/4852/
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1833417703207993344
author Yabagi, Jibrin Alhaji
Kimpa, Mohammed Isah
Muhammad, Muhammad Nmaya
Nayan, Nafarizal
Embong, Zaidi
Agam, Mohd Arif
author_facet Yabagi, Jibrin Alhaji
Kimpa, Mohammed Isah
Muhammad, Muhammad Nmaya
Nayan, Nafarizal
Embong, Zaidi
Agam, Mohd Arif
author_sort Yabagi, Jibrin Alhaji
building UTHM Library
collection Institutional Repository
content_provider Universiti Tun Hussein Onn Malaysia
content_source UTHM Institutional Repository
continent Asia
country Malaysia
description Nanospheres made of organic polymer have been applied to generate various patterning mask in fabricating functional nanostructures. The patterning and generation of semiconductor nanostructures through nanospheres mask provides a potential alternative to the conventional top-down fabrication techniques. Polystyrene nanosphere was modified using reactive ion etching (RIE) with O2 plasma at various duration of exposure (0, 20, 40 sec) and further extended to produce nanostructure by employing combination of O2 and mixed CHF3/SF6 gases. These edge PS nanospheres are later reduced as nanostructures and characterized using various characterization techniques such as Field Emission Scan Electron Microscopy/Energy Dispersive X-ray Spectroscopy (FESEM)/EDS, Atomic Force Microscopy and Fourier Transformation Infrared Spectroscopy (FTIR). The potential for multi stages etching procedures of O2 and later with SF6/CHF3 plasma etching are found to modify the nanospheres shapes and sizes which are important either as secondary mask for metal evaporation or as direct patterning of carbonaceous materials when exposed to irradiation sources. The nanostructures made using RIE will have applications in low power high performance electronic devices, optoelectronic, photovoltaic, biosensors and lithium ion battery devices.
format Article
id my.uthm.eprints-4852
institution Universiti Tun Hussein Onn Malaysia
language en
publishDate 2017
publisher UTHM Publisher
record_format eprints
spelling my.uthm.eprints-48522021-12-21T07:39:56Z http://eprints.uthm.edu.my/4852/ Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface Yabagi, Jibrin Alhaji Kimpa, Mohammed Isah Muhammad, Muhammad Nmaya Nayan, Nafarizal Embong, Zaidi Agam, Mohd Arif T Technology (General) TA401-492 Materials of engineering and construction. Mechanics of materials Nanospheres made of organic polymer have been applied to generate various patterning mask in fabricating functional nanostructures. The patterning and generation of semiconductor nanostructures through nanospheres mask provides a potential alternative to the conventional top-down fabrication techniques. Polystyrene nanosphere was modified using reactive ion etching (RIE) with O2 plasma at various duration of exposure (0, 20, 40 sec) and further extended to produce nanostructure by employing combination of O2 and mixed CHF3/SF6 gases. These edge PS nanospheres are later reduced as nanostructures and characterized using various characterization techniques such as Field Emission Scan Electron Microscopy/Energy Dispersive X-ray Spectroscopy (FESEM)/EDS, Atomic Force Microscopy and Fourier Transformation Infrared Spectroscopy (FTIR). The potential for multi stages etching procedures of O2 and later with SF6/CHF3 plasma etching are found to modify the nanospheres shapes and sizes which are important either as secondary mask for metal evaporation or as direct patterning of carbonaceous materials when exposed to irradiation sources. The nanostructures made using RIE will have applications in low power high performance electronic devices, optoelectronic, photovoltaic, biosensors and lithium ion battery devices. UTHM Publisher 2017 Article PeerReviewed text en http://eprints.uthm.edu.my/4852/1/AJ%202017%20%28674%29.pdf Yabagi, Jibrin Alhaji and Kimpa, Mohammed Isah and Muhammad, Muhammad Nmaya and Nayan, Nafarizal and Embong, Zaidi and Agam, Mohd Arif (2017) Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface. Journal of Science and Technology, 9 (3). pp. 145-153. ISSN 2229-8460
spellingShingle T Technology (General)
TA401-492 Materials of engineering and construction. Mechanics of materials
Yabagi, Jibrin Alhaji
Kimpa, Mohammed Isah
Muhammad, Muhammad Nmaya
Nayan, Nafarizal
Embong, Zaidi
Agam, Mohd Arif
Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface
title Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface
title_full Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface
title_fullStr Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface
title_full_unstemmed Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface
title_short Nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface
title_sort nanofabrication process by reactive ion etching of polystyrene nanosphere on silicon surface
topic T Technology (General)
TA401-492 Materials of engineering and construction. Mechanics of materials
url http://eprints.uthm.edu.my/4852/1/AJ%202017%20%28674%29.pdf
http://eprints.uthm.edu.my/4852/
url_provider http://eprints.uthm.edu.my/