Eliminating adhesive layers in silver metallization: A comparative study of glass cleaning methods for enhanced hydroxylation and adhesion
Achieving robust adhesion and cost-efficiency in silver (Ag) thin films is pivotal for advancing microelectronic applications, owing to Ag’s exceptional low resistivity and thermal stability. This study investigates an optimized approach to hydroxylate glass substrates, effectively eliminating the r...
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| Language: | en |
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2025
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| Online Access: | http://eprints.uthm.edu.my/12704/1/J19532_17b2671c66eb1d12379da68fa430ea67.pdf http://eprints.uthm.edu.my/12704/ https://doi.org/10.1016/j.cap.2025.01.002 |
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| author | Abu Bakar, Amnani Hashim, N.H Tajuddin, H.A Sadun, A.S Abidin, Z.H.Z |
| author_facet | Abu Bakar, Amnani Hashim, N.H Tajuddin, H.A Sadun, A.S Abidin, Z.H.Z |
| author_sort | Abu Bakar, Amnani |
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| content_provider | Universiti Tun Hussein Onn Malaysia |
| content_source | UTHM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | Achieving robust adhesion and cost-efficiency in silver (Ag) thin films is pivotal for advancing microelectronic applications, owing to Ag’s exceptional low resistivity and thermal stability. This study investigates an optimized approach to hydroxylate glass substrates, effectively eliminating the reliance on conventional adhesive layers. Among five chemical cleaning methods evaluated, immersion in concentrated H₂SO₄, followed by thorough rinsing with deionized water and ultrasonication in ethanol, emerged as the most effective. This method produced highly hydrophilic surfaces with a contact angle (CA) of 6.6◦. The resulting Ag films, deposited via physical vapor deposition, demonstrated excellent adhesion without peeling, while also exhibiting smooth and uniform surfaces ideal for subsequent functionalization. By streamlining substrate preparation, this methodology enhances the fabrication efficiency of high-performance microelectronic devices, offering a practical and scalable
solution for industrial applications. |
| format | Article |
| id | my.uthm.eprints-12704 |
| institution | Universiti Tun Hussein Onn Malaysia |
| language | en |
| publishDate | 2025 |
| publisher | elsevier |
| record_format | eprints |
| spelling | my.uthm.eprints-127042025-06-20T08:18:21Z http://eprints.uthm.edu.my/12704/ Eliminating adhesive layers in silver metallization: A comparative study of glass cleaning methods for enhanced hydroxylation and adhesion Abu Bakar, Amnani Hashim, N.H Tajuddin, H.A Sadun, A.S Abidin, Z.H.Z TK Electrical engineering. Electronics Nuclear engineering Achieving robust adhesion and cost-efficiency in silver (Ag) thin films is pivotal for advancing microelectronic applications, owing to Ag’s exceptional low resistivity and thermal stability. This study investigates an optimized approach to hydroxylate glass substrates, effectively eliminating the reliance on conventional adhesive layers. Among five chemical cleaning methods evaluated, immersion in concentrated H₂SO₄, followed by thorough rinsing with deionized water and ultrasonication in ethanol, emerged as the most effective. This method produced highly hydrophilic surfaces with a contact angle (CA) of 6.6◦. The resulting Ag films, deposited via physical vapor deposition, demonstrated excellent adhesion without peeling, while also exhibiting smooth and uniform surfaces ideal for subsequent functionalization. By streamlining substrate preparation, this methodology enhances the fabrication efficiency of high-performance microelectronic devices, offering a practical and scalable solution for industrial applications. elsevier 2025 Article PeerReviewed text en http://eprints.uthm.edu.my/12704/1/J19532_17b2671c66eb1d12379da68fa430ea67.pdf Abu Bakar, Amnani and Hashim, N.H and Tajuddin, H.A and Sadun, A.S and Abidin, Z.H.Z (2025) Eliminating adhesive layers in silver metallization: A comparative study of glass cleaning methods for enhanced hydroxylation and adhesion. Current Applied Physics, 71. pp. 138-143. https://doi.org/10.1016/j.cap.2025.01.002 |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Abu Bakar, Amnani Hashim, N.H Tajuddin, H.A Sadun, A.S Abidin, Z.H.Z Eliminating adhesive layers in silver metallization: A comparative study of glass cleaning methods for enhanced hydroxylation and adhesion |
| title | Eliminating adhesive layers in silver metallization: A comparative study of
glass cleaning methods for enhanced hydroxylation and adhesion |
| title_full | Eliminating adhesive layers in silver metallization: A comparative study of
glass cleaning methods for enhanced hydroxylation and adhesion |
| title_fullStr | Eliminating adhesive layers in silver metallization: A comparative study of
glass cleaning methods for enhanced hydroxylation and adhesion |
| title_full_unstemmed | Eliminating adhesive layers in silver metallization: A comparative study of
glass cleaning methods for enhanced hydroxylation and adhesion |
| title_short | Eliminating adhesive layers in silver metallization: A comparative study of
glass cleaning methods for enhanced hydroxylation and adhesion |
| title_sort | eliminating adhesive layers in silver metallization: a comparative study of
glass cleaning methods for enhanced hydroxylation and adhesion |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://eprints.uthm.edu.my/12704/1/J19532_17b2671c66eb1d12379da68fa430ea67.pdf http://eprints.uthm.edu.my/12704/ https://doi.org/10.1016/j.cap.2025.01.002 |
| url_provider | http://eprints.uthm.edu.my/ |