The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish

The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal a...

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Bibliographic Details

Main Authors:	Nabilah Awang Azman, Dayang Izzah, Osman, Saliza Azlina, Narayanan, Pavithiran, Kozutsumi, Yuji
Format:	Article
Language:	en
Published:	Elsevier 2024
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.uthm.edu.my/12350/1/J17765_a5b3dfe2c3ca9b1437dfc6d24b247211.pdf http://eprints.uthm.edu.my/12350/ https://doi.org/10.37934/armne.17.1.6975
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