The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish
The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal a...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | en |
| Published: |
Elsevier
2024
|
| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/12350/1/J17765_a5b3dfe2c3ca9b1437dfc6d24b247211.pdf http://eprints.uthm.edu.my/12350/ https://doi.org/10.37934/armne.17.1.6975 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|