The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish
The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal a...
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| Language: | en |
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Elsevier
2024
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| Online Access: | http://eprints.uthm.edu.my/12350/1/J17765_a5b3dfe2c3ca9b1437dfc6d24b247211.pdf http://eprints.uthm.edu.my/12350/ https://doi.org/10.37934/armne.17.1.6975 |
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| author | Nabilah Awang Azman, Dayang Izzah Osman, Saliza Azlina Narayanan, Pavithiran Kozutsumi, Yuji |
| author_facet | Nabilah Awang Azman, Dayang Izzah Osman, Saliza Azlina Narayanan, Pavithiran Kozutsumi, Yuji |
| author_sort | Nabilah Awang Azman, Dayang Izzah |
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| content_provider | Universiti Tun Hussein Onn Malaysia |
| content_source | UTHM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal ageing process. This study investigated the
effect of the IMC formation and microstructure evolution during reflow soldering and isothermal ageing using SN100C lead-free solders and ENIG surface finish. The characterization of the IMC formed during both reflow soldering and isothermal ageing in terms of the type, morphology, and thickness is then analyzed by using the Optical Microscope (OM), Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX). The result reveals that there are two IMC formed at an interface between SN100C and ENIG which are (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 where (Ni, Cu)3Sn4 grows beneath (Cu, Ni)6Sn5. The thickness of the IMC formation in the SN100C/ENIG solder joint is also directly proportional to the ageing duration, indicating that the longer the time of the IMC exposed to high temperature affects the thickness of the IMC. |
| format | Article |
| id | my.uthm.eprints-12350 |
| institution | Universiti Tun Hussein Onn Malaysia |
| language | en |
| publishDate | 2024 |
| publisher | Elsevier |
| record_format | eprints |
| spelling | my.uthm.eprints-123502025-05-05T04:43:42Z http://eprints.uthm.edu.my/12350/ The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish Nabilah Awang Azman, Dayang Izzah Osman, Saliza Azlina Narayanan, Pavithiran Kozutsumi, Yuji TK Electrical engineering. Electronics Nuclear engineering The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal ageing process. This study investigated the effect of the IMC formation and microstructure evolution during reflow soldering and isothermal ageing using SN100C lead-free solders and ENIG surface finish. The characterization of the IMC formed during both reflow soldering and isothermal ageing in terms of the type, morphology, and thickness is then analyzed by using the Optical Microscope (OM), Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX). The result reveals that there are two IMC formed at an interface between SN100C and ENIG which are (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 where (Ni, Cu)3Sn4 grows beneath (Cu, Ni)6Sn5. The thickness of the IMC formation in the SN100C/ENIG solder joint is also directly proportional to the ageing duration, indicating that the longer the time of the IMC exposed to high temperature affects the thickness of the IMC. Elsevier 2024 Article PeerReviewed text en http://eprints.uthm.edu.my/12350/1/J17765_a5b3dfe2c3ca9b1437dfc6d24b247211.pdf Nabilah Awang Azman, Dayang Izzah and Osman, Saliza Azlina and Narayanan, Pavithiran and Kozutsumi, Yuji (2024) The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish. Journal of Advanced Research in Micro and Nano Engineering, 17 (1). pp. 69-75. https://doi.org/10.37934/armne.17.1.6975 |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Nabilah Awang Azman, Dayang Izzah Osman, Saliza Azlina Narayanan, Pavithiran Kozutsumi, Yuji The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish |
| title | The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish |
| title_full | The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish |
| title_fullStr | The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish |
| title_full_unstemmed | The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish |
| title_short | The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish |
| title_sort | effect of isothermal aging on the intermetallic growth between sn100c lead-free solders and enig surface finish |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| url | http://eprints.uthm.edu.my/12350/1/J17765_a5b3dfe2c3ca9b1437dfc6d24b247211.pdf http://eprints.uthm.edu.my/12350/ https://doi.org/10.37934/armne.17.1.6975 |
| url_provider | http://eprints.uthm.edu.my/ |