APA (7th ed.) Citation

Thangaraj, J. S. A., Chua, K. Y., Yeow, S. L., Lim, W. K., & Hng, M. T. (2013). Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads. Elsevier.

Chicago Style (17th ed.) Citation

Thangaraj, Joseph Sahaya Anand, Kok Yau Chua, See Leong Yeow, Weng Keat Lim, and May Ting Hng. Microstructural and Mechanical Analysis of Cu and Au Interconnect on Various Bond Pads. Elsevier, 2013.

MLA (9th ed.) Citation

Thangaraj, Joseph Sahaya Anand, et al. Microstructural and Mechanical Analysis of Cu and Au Interconnect on Various Bond Pads. Elsevier, 2013.