Chua, K. Y., Hng, M. T., Lee, C. C., & Thangaraj, J. S. A. (2003). XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip. Trans Tech Publications, Switzerland.
Chicago Style (17th ed.) CitationChua, Kok Yau, May Ting Hng, Cher Chia Lee, and Joseph Sahaya Anand Thangaraj. XRD Analysis of Cu-Al Interconnect Intermetallic Compound in an Annealed Micro-chip. Trans Tech Publications, Switzerland, 2003.
MLA (9th ed.) CitationChua, Kok Yau, et al. XRD Analysis of Cu-Al Interconnect Intermetallic Compound in an Annealed Micro-chip. Trans Tech Publications, Switzerland, 2003.
Warning: These citations may not always be 100% accurate.
