A. P., P. (2012). A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress.
Chicago Style (17th ed.) CitationA. P., Puvanasvaran. A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) On Ball Bond Strength After Temperature Cycle Stress. 2012.
MLA (9th ed.) CitationA. P., Puvanasvaran. A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) On Ball Bond Strength After Temperature Cycle Stress. 2012.
Warning: These citations may not always be 100% accurate.