APA (7th ed.) Citation

Thangaraj, J. S. A., Chua, K. Y., Abd Rashid, M. W., Hng, M. T., & Lee, C. C. (2012). Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface.

Chicago Style (17th ed.) Citation

Thangaraj, Joseph Sahaya Anand, Kok Yau Chua, Mohd Warikh Abd Rashid, May Ting Hng, and Cher Chia Lee. Microstructural Studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface. 2012.

MLA (9th ed.) Citation

Thangaraj, Joseph Sahaya Anand, et al. Microstructural Studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface. 2012.