Thangaraj, J. S. A., Chua, K. Y., & Lim, B. H. (2012). Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip. Elsevier.
Chicago Style (17th ed.) CitationThangaraj, Joseph Sahaya Anand, Kok Yau Chua, and Boon Huat Lim. Oxidation Study on As-bonded Intermetallic of Copper Wire-aluminum Bond Pad Metallization for Electronic Microchip. Elsevier, 2012.
MLA (9th ed.) CitationThangaraj, Joseph Sahaya Anand, et al. Oxidation Study on As-bonded Intermetallic of Copper Wire-aluminum Bond Pad Metallization for Electronic Microchip. Elsevier, 2012.
Warning: These citations may not always be 100% accurate.