Application of Total Productive Maintenance to Reduce Non-Stick on Pad Problem in IC Packaging
Focus improvement activity was employed to improve front-end assembly yield in integrated circuit packaging. The top three yield losses in parts per million (ppm) in front-end assembly were contributed by the following defects: non-stick on pad (NSOP) (2715 ppm), chip and crack (782 ppm) and missing...
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| Format: | Article |
| Language: | en |
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Universitas Malahayati Press
2012
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| Online Access: | http://eprints.utem.edu.my/id/eprint/6486/1/2012_APPLICATION_OF_TOTAL_PRODUCTIVE_MAINTENANCE_TO_REDUCE.pdf http://eprints.utem.edu.my/id/eprint/6486/ |
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