Mohd Noh, M. S. A., Liew, D., & Harun, F. (2010). Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process. IEEE Conference Publications.
Chicago Style (17th ed.) CitationMohd Noh, Mohd Syahrin Amri, David Liew, and Fuaida Harun. Chipping Free Process for Combination of Narrow Saw Street (60um) and Thick Wafer (600um) Sawing Process. IEEE Conference Publications, 2010.
MLA (9th ed.) CitationMohd Noh, Mohd Syahrin Amri, et al. Chipping Free Process for Combination of Narrow Saw Street (60um) and Thick Wafer (600um) Sawing Process. IEEE Conference Publications, 2010.
Warning: These citations may not always be 100% accurate.