Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device

The optimization of 45nm NMOS device was studied using Taguchi Method. This method was used to analyze the experimental data in order to get the optimum results. In this paper, there are four factors were varied for 3 levels to perform 9 experiments. Silicide on the poly-Si gate electrode was us...

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Main Author: Fauziyah, Salehuddin
Format: Article
Language:en
Published: IJENS Publishers 2009
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Online Access:http://eprints.utem.edu.my/id/eprint/3792/1/%28J1%29_97010-0404_IJET-IJENS.pdf
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author Fauziyah, Salehuddin
author_facet Fauziyah, Salehuddin
author_sort Fauziyah, Salehuddin
building UTEM Library
collection Institutional Repository
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
continent Asia
country Malaysia
description The optimization of 45nm NMOS device was studied using Taguchi Method. This method was used to analyze the experimental data in order to get the optimum results. In this paper, there are four factors were varied for 3 levels to perform 9 experiments. Silicide on the poly-Si gate electrode was used to reduce the gate electrode resistance. The virtually fabrication of 45nm NMOS device was performed by using ATHENA module. While the electrical characterization of device was implemented by using ATLAS module. The values of oxide and silicide thickness after optimization approach were 1.52709nm and 25.26nm respectively. The result of the threshold voltage (VTH) is 0.148468 Volts. In this research, silicide thickness and oxide thickness are the main factors were identified as the source of the inability of the transistors to perform. The oxide thickness also was identified as one of the factors that has the strongest effect on the response characteristics.
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spelling my.utem.eprints-37922021-11-25T12:04:25Z http://eprints.utem.edu.my/id/eprint/3792/ Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device Fauziyah, Salehuddin TA Engineering (General). Civil engineering (General) The optimization of 45nm NMOS device was studied using Taguchi Method. This method was used to analyze the experimental data in order to get the optimum results. In this paper, there are four factors were varied for 3 levels to perform 9 experiments. Silicide on the poly-Si gate electrode was used to reduce the gate electrode resistance. The virtually fabrication of 45nm NMOS device was performed by using ATHENA module. While the electrical characterization of device was implemented by using ATLAS module. The values of oxide and silicide thickness after optimization approach were 1.52709nm and 25.26nm respectively. The result of the threshold voltage (VTH) is 0.148468 Volts. In this research, silicide thickness and oxide thickness are the main factors were identified as the source of the inability of the transistors to perform. The oxide thickness also was identified as one of the factors that has the strongest effect on the response characteristics. IJENS Publishers 2009-12-10 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/3792/1/%28J1%29_97010-0404_IJET-IJENS.pdf Fauziyah, Salehuddin (2009) Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device. International Journal of Engineering & Technology, 9 (10). pp. 94-98. ISSN 2077-1185 (Online) 2227-2712 (Print) http://www.ijens.org/index.htm
spellingShingle TA Engineering (General). Civil engineering (General)
Fauziyah, Salehuddin
Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device
title Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device
title_full Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device
title_fullStr Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device
title_full_unstemmed Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device
title_short Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45nm NMOS Device
title_sort application of taguchi method in optimization of gate oxide and silicide thickness for 45nm nmos device
topic TA Engineering (General). Civil engineering (General)
url http://eprints.utem.edu.my/id/eprint/3792/1/%28J1%29_97010-0404_IJET-IJENS.pdf
http://eprints.utem.edu.my/id/eprint/3792/
http://www.ijens.org/index.htm
url_provider http://eprints.utem.edu.my/