Mohd Noh, M. S. A., Omar, G., Mispan, M. S., Harun, F., Othman, M. N., Ngatiman, N. A., & Mat Ibrahim, M. (2024). Wafer dicing vibration investigation on novel wafer mounting techniques. Institute Of Electrical And Electronics Engineers Inc.
Chicago Style (17th ed.) CitationMohd Noh, Mohd Syahrin Amri, Ghazali Omar, Mohd Syafiq Mispan, Fuaida Harun, Md Nazri Othman, Nor Azazi Ngatiman, and Masrullizam Mat Ibrahim. Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques. Institute Of Electrical And Electronics Engineers Inc, 2024.
MLA (9th ed.) CitationMohd Noh, Mohd Syahrin Amri, et al. Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques. Institute Of Electrical And Electronics Engineers Inc, 2024.
Warning: These citations may not always be 100% accurate.