Thermal expansion flow analysis in designing a sustainability computer personal unit casing
The material of computer personal unit is commonly used metal based. The problem occurs when waste of electronic device to be recycled. This paper describes the thermal expansion flow in designing a sustainability computer personal unit (CPU) casing based on the material selection technique. In t...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | en |
| Published: |
2023
|
| Online Access: | http://eprints.utem.edu.my/id/eprint/28015/1/Thermal%20expansion%20flow%20analysis%20in%20designing%20a%20sustainability%20computer%20personal%20unit%20casing.pdf http://eprints.utem.edu.my/id/eprint/28015/ https://iopscience.iop.org/article/10.1088/1755-1315/1169/1/012081 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | The material of computer personal unit is commonly used metal based. The problem
occurs when waste of electronic device to be recycled. This paper describes the thermal
expansion flow in designing a sustainability computer personal unit (CPU) casing based on the
material selection technique. In this study, the design concepts were generated to be processed
for screening matrix with criteria selection of comfortable, user friendly, ergonomic, flexible,
functionality and material. Design concept 4 was selected to be further analyzed. The material
selection technique was used in this study using CES Edupack and provide the material of
Acrylonitrile butadiene styrene (ABS), Polyetheretherketone (PEEK), and Polyoxymethylene
(Acetal, POM) for analysis based on criteria of recycle ability, price, hardness, density, and
temperature maximum. The ABS material suits the design requirement toward sustainability
computer personal unit. Based on the simulation result, the thermal expansion flow meets the
design specification. In addition, the phenomena of heat dissipated from internal CPU shows
significant information for design manufacturing to manage and place the electronic parts
properly to reduce the risk of overheated and damaged. |
|---|
