Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process

Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon...

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Bibliographic Details

Main Author:	Liou, Jacqueline Jing Wen
Format:	Thesis
Language:	en en
Published:	2020
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://eprints.utem.edu.my/id/eprint/25573/1/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf http://eprints.utem.edu.my/id/eprint/25573/2/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf http://eprints.utem.edu.my/id/eprint/25573/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119122
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